tag: thermal management

Making On-Chip Photonics Manufacturable
By Gregory Haley - 18 Jun, 2026 - Comments: 0

Key Takeaways: System-level energy and bandwidth pressures are pulling optics into the package faster than the manufacturing flow can mature. Photonics combines front-end fabrication, materials, thermal, cleanliness, and test into one problem that can’t be solved domain by domain. Test is moving upstream because discovering an optical failure after final assembly forfeits every goo... » read more

Mastering 3D-IC Verification Complexity
By Matt Grange - 11 Jun, 2026 - Comments: 0

The semiconductor industry's transition from traditional 2D integrated circuits to 2.5D and 3D-IC configurations represents more than an incremental advancement. This architectural shift, driven by the need to push beyond conventional scaling limitations, introduces a cascade of verification challenges that legacy methodologies struggle to address. As designs incorporate multiple stacked dies, ... » read more

Deterministic, Solver-Accurate Thermal and Warpage Analysis at Manufacturing Resolution for Advanced 2.5D HBM Packages
By Vinci - 27 May, 2026 - Comments: 0

Thermal management has become the defining bottleneck in high-performance computing (HPC) and AI accelerator packaging. Modern packages integrate high-power ASICs with multiple High Bandwidth Memory (HBM) stacks on a silicon interposer, creating tightly coupled thermal and mechanical interactions. Die-to-die thermal crosstalk elevates HBM junction temperatures, while coefficient of thermal e... » read more

Alumina Nanowires Improve Thermal Management in Advanced Packaging (Georgia Tech et al.)
By Technical Paper Link - 28 Apr, 2026 - Comments: 0

A new technical paper, "Epoxy Composites Reinforced with Long Al2O3 Nanowires for Enhanced Thermal Management in Advanced Semiconductor Packaging," was published by researchers at the Georgia Institute of Technology and National Cheng Kung University. Abstract "The rapid increase in heat flux in advanced 2.5D/3D semiconductor packaging places stringent demands on thermal interface materia... » read more

New CPU Memory Module
By Ed Sperling - 28 Apr, 2026 - Comments: 0

Moving data has become the top challenge inside data centers. There is more data to process, more to move, and more to store and retrieve from memory. This is where small outline compression attached memory modules (SOCAMMs) fit in. Frank Ferro, group director for product management at Cadence, talks about the benefits of this next-gen modular low-power memory standard, how it compares with oth... » read more

Why Co-Packaged Optics Should be Viewed as an Architectural Commitment (UW-Madison, MIT et al.)
By Technical Paper Link - 31 Mar, 2026 - Comments: 0

A new technical paper, "3D optoelectronics and co-packaged optics: when solving the wrong problems stalls deployment," by the University of Wisconsin, MIT, and Invictus Innovation EV Technology. Abstract "The rapid growth of AI and accelerator-driven workloads is forcing a fundamental rethinking of optical interconnect architectures in datacenters. Co-packaged optics and three-dimensional... » read more

Chiplets And 3D-ICs Add New Electrical And Mechanical Challenges
By Ann Mutschler - 12 Feb, 2026 - Comments: 1

Key Takeaways • Chiplets and 3D-IC architectures add new thermal-mechanical stresses that can affect the reliability of entire systems. • As chiplets are assembled into packages, defectivity targets become more stringent for each component in a system. • Traditional silos are breaking down, forcing design teams to address issues such as materials choices that previously were handled by... » read more

Reliability Risks Shift To The Materials Stack
By Gregory Haley - 18 Dec, 2025 - Comments: 0

The semiconductor industry’s push into 3D integration and large-format substrates has fundamentally changed the role of materials in packaging. What were once structural supports and electrical insulators have become critical performance limiters. Modern packages contain far more polymers, adhesives, advanced dielectrics, thermal materials, and composite laminates than previous generations... » read more

Thermal Management In 3D-IC: Modeling Hotspots, Materials, & Cooling Strategies
By Reela Samuel - 11 Dec, 2025 - Comments: 1

As three-dimensional integrated circuit (3D-IC) technology becomes the architectural backbone of AI, high-performance computing (HPC), and advanced edge systems, thermal management has shifted from a downstream constraint to a fundamental design driver. The dense vertical integration that enables unprecedented performance also concentrates heat at levels that traditional two-dimensional design ... » read more

Thermal Sensing Headache Finally Over For 2nm And Beyond
By Nir Sever - 11 Nov, 2025 - Comments: 0

Effective thermal management is crucial to prevent overheating and optimize performance in modern SoCs. Inadequate temperature control due to inaccurate thermal sensing compromises power management, reliability, processing speed, and lifespan, leading to issues like electromigration, hot carrier injection, and even thermal runaway. Unfortunately, precise thermal monitoring reached an inflect... » read more

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