tag: thermal management

Thermal Sensing Headache Finally Over For 2nm And Beyond
By Nir Sever - 11 Nov, 2025 - Comments: 0

Effective thermal management is crucial to prevent overheating and optimize performance in modern SoCs. Inadequate temperature control due to inaccurate thermal sensing compromises power management, reliability, processing speed, and lifespan, leading to issues like electromigration, hot carrier injection, and even thermal runaway. Unfortunately, precise thermal monitoring reached an inflect... » read more

3D Stacked HBM and Accelerators for LLMs: Heat Management and PDN (Georgia Tech, SK Hynix)
By Technical Paper Link - 17 Oct, 2025 - Comments: 0

A new technical paper titled "3D Stacked HBM and Compute Accelerators for LLM: Optimizing Thermal Management and Power Delivery Efficiency" was published by a researcher from Georgia Institute of Technology and SK Hynix. Abstract "Advanced packaging is becoming essential for designing hardware accelerators for large language models (LLMs). Different architectures such as 2.5D integration of... » read more

Examination Of Thermal Issues Related to Hybrid Bonding of 3D-Stacked HBM
By Technical Paper Link - 16 Jul, 2025 - Comments: 0

A new technical paper titled "Thermal Issues Related to Hybrid Bonding of 3D-Stacked High Bandwidth Memory: A Comprehensive Review" was published by researchers at Chungbuk National University. Abstract "High-Bandwidth Memory (HBM) enables the bandwidth required by modern AI and high-performance computing, yet its three dimensional stack traps heat and amplifies thermo mechanical stress. We... » read more

Can You Build A Known-Good Multi-Die System?
By Ed Sperling - 18 Jun, 2025 - Comments: 0

Semiconductor Engineering sat down to discuss the challenges of designing and testing multi-die systems, including how to ensure they will work as expected, with Bill Mullen, Ansys fellow; John Ferguson, senior director of product management at Siemens EDA; Chris Mueth, senior director of new markets and strategic initiatives at Keysight; Albert Zeng, senior engineering group director at Cadenc... » read more

Cooling Chips Still A Top Challenge
By Bryon Moyer - 22 May, 2025 - Comments: 0

Increasing levels of semiconductor integration means more work needs to be done in smaller spaces, which in turn generates more heat that needs to be dissipated. Managing heat dissipation in advanced node dies and in multi-die assemblies is critical to their functionality and their longevity. And while much of the focus has been on improving power efficiency, which reduces the rate of power ... » read more

Optimization Approach For The Dispensing of Thermal Interface Material (KIT, Robert Bosch)
By Technical Paper Link - 21 May, 2025 - Comments: 0

A new technical paper titled "TIMtrace: Coverage Path Planning for Thermal Interface Materials" was published by researchers at Karlsruhe Institute of Technology (KIT) and Robert Bosch GmbH. Abstract "Thermal Interface Materials are used to transfer heat from a semiconductor to a heatsink. They are applied along a dispense path onto the semiconductor and spread over its entire surface once ... » read more

Floorplanning Method For Reducing Thermally-Induced Structural Stress In Chiplet Packages (Penn State, Intel, ASU et al.)
By Technical Paper Link - 14 May, 2025 - Comments: 0

A new technical paper titled "STAMP-2.5D: Structural and Thermal Aware Methodology for Placement in 2.5D Integration" was published by researchers at Pennsylvania State University, Intel, Arizona State University and University of Notre Dame. Abstract "Chiplet-based architectures and advanced packaging has emerged as transformative approaches in semiconductor design. While conventional ph... » read more

Innovation And Collaboration In Power Module Packaging: A Thermal Perspective
By Thomas Wang - 17 Apr, 2025 - Comments: 0

Power modules are the foundation of modern electrical systems, especially within electric vehicles (xEVs), industrial motor applications, and renewable energy solutions such as wind and solar power. As the demand for more power in smaller and lighter systems grows, managing heat dissipation has become a major challenge, as the thermal energy from high current flows can lead to reliability issue... » read more

Chiplets Add New Power Issues
By Ann Mutschler - 13 Mar, 2025 - Comments: 0

Delivering and managing power are becoming key challenges in the rollout of chiplets, adding significantly to design complexity and forcing chipmakers to weigh tradeoffs that can have a big impact on the performance, reliability, and the overall cost of semiconductors. Power is a concern for every chip and chiplet design, even if the specifics differ based on the application. Systems vendors... » read more

Thermally Aware Chiplet Placement Algorithm Based on Automatic Differentiation (MIT, IBM)
By Technical Paper Link - 07 Mar, 2025 - Comments: 0

A new technical paper titled "DiffChip: Thermally Aware Chip Placement with Automatic Differentiation" was published by researchers at MIT and IBM. Abstract "Chiplets are modular integrated circuits that can be combined to form a larger system, offering flexibility and performance enhancements. However, their dense packing often leads to significant thermal management challenges, requiring ... » read more

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