Coming In Hot: Requirements For Successful Thermal Management In 3D-IC


As the speed, density, and capabilities of electronics have all increased, power has become a first order driver in almost all electronic systems. For instance, it’s well recognized that heat is often the number one limiting factor in 3D-IC design. High-speed chips stacked close together in a small housing cause things to heat up fast. One of the most common designer responses to overheating ... » read more

Speeding-Up Thermal Simulations Of Chips With ML


A new technical paper titled "A Thermal Machine Learning Solver For Chip Simulation" was published by researchers at Ansys. Abstract "Thermal analysis provides deeper insights into electronic chips' behavior under different temperature scenarios and enables faster design exploration. However, obtaining detailed and accurate thermal profile on chip is very time-consuming using FEM or CFD. Th... » read more

Monolithic Microfluidic Cooling on a Functional CPU Running Real-World Benchmarks


New technical paper titled "Integrated Silicon Microfluidic Cooling of a High-Power Overclocked CPU for Efficient Thermal Management" is published by researchers at Georgia Tech and Microsoft. According to the abstract: "In this work, we use micropin-fins etched directly on the back of an Intel Core i7-8700K CPU and overclocked it to dissipate up to 215W of power while being cooled by room... » read more

Thermal Cycling Failure In Electronics


Each time a device is turned off and on, its temperature changes. (Just think about how often your phone lights up all day.) Energy flowing through several layers of tightly stacked materials causes devices to heat up, then rapidly cool down. This repeated oscillation between temperatures over the lifetime of a device is called thermal cycling. Why thermal management is important Thermal cycl... » read more

Thermal Management Challenges and Requirements of 3 types of Microelectronic Devices


New technical paper titled "A Review on Transient Thermal Management of Electronic Devices" from researchers at Indian Institute of Technology Bombay. Abstract "Much effort in the area of electronics thermal management has focused on developing cooling solutions that cater to steady-state operation. However, electronic devices are increasingly being used in applications involving time-varyi... » read more

Review of Bumpless Build Cube Using Wafer-on-Wafer & Chip-on-Wafer for Tera-Scale 3D Integration


New research paper titled "Review of Bumpless Build Cube (BBCube) Using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI)" from researchers at Tokyo Institute of Technology and others. Abstract "Bumpless Build Cube (BBCube) using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI) is discussed. Bum... » read more

Thermal Floorplanning For Chips


Heat management is becoming crucial to an increasing number of chips, and it's one of a growing number of interconnected factors that must be considered throughout the entire development flow. At the same time, design requirements are exacerbating thermal problems. Those designs either have to increase margins or become more intelligent about the way heat is generated, distributed, and dissi... » read more

Mapping Heat Across A System


Thermal issues are becoming more difficult to resolve as chip features get smaller and systems get faster and more complex. They now require the integration of technologies from both the design and manufacturing flows, making design for power and heat a much broader problem. This is evident with the evolution of a smart phone. Phones sold 10 years ago were very different devices. Functionali... » read more

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging


Abstract: "Thermal metamaterials exhibit thermal properties that do not exist in nature but can be rationally designed to offer unique capabilities of controlling heat transfer. Recent advances have demonstrated successful manipulation of conductive heat transfer and led to novel heat guiding structures such as thermal cloaks, concentrators, etc. These advances imply new opportunities to gui... » read more

Development Of An Extremely High Thermal Conductivity TIM For Large Electronics Packages In 4th Industrial Revolution Era


The capability and diversity of high-performance microprocessors is increasing with each process technology generation to meet increasing application demands. The cooling designs for these chips must deal with larger temperature gradients across the die than previous generations. Dissipation of the thermal energy from heat generating parts to a heat sink via conduction occurs through a thermal ... » read more

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