Internet Of Things Design Considerations For Embedded Connected Devices

Technical issues increase, costs go up, and not all markets will benefit.

Chipmakers wrestle with EOS, ESD and other power-related issues as leading-edge chips are incorporated into industrial and automotive applications.

Proponents tout freedom for computing architectures, but is the semiconductor ecosystem ready for open-source hardware?

Advanced packaging shifts to mainstream with complete flows, better tools, market proof points.

Foundry unit rolls out ambitious plan down to 4nm, along with 18nm FD-SOI and advanced packaging developments.

There are multiple layers in which machine learning can help with the creation of semiconductors, but getting there is not as simple as for other application areas.

Next-gen embedded memory technology ramps up in wake of flash scaling issues.

Transition from planar to 3D NAND is harder and more time-consuming than expected.