tag: Rambus

Blog Review: Jan. 11
By Jesse Allen - 11 Jan, 2017 - Comments: 0

Mentor's Ron Press examines why test hasn't become a bottleneck in creating ever more advanced semiconductors. Synopsys' Graham Etchells warns that while finFET technologies have been successful, challenges persist. Cadence's Paul McLellan shares a behind-the-scenes look at developing the Palladium Z1 emulator. The White House's Craig Mundie and Paul Otellini highlight a PCAST report o... » read more

The Week In Review: IoT
By Jeff Dorsch - 06 Jan, 2017 - Comments: 0

Products Qualcomm reported before the official opening of CES 2017 that it has shipped more than 1 billion Internet of Things chips to date, for such applications as automotive electronics, Internet-connected televisions, sensors, and wearable gadgets (including smartwatches). The company didn’t include chips for smartphones and tablet computers in that total. “We have scale,” said Raj T... » read more

Making Secure Chips For IoT Devices
By Jeff Dorsch - 05 Jan, 2017 - Comments: 1

Chips and modules going into Internet of Things node devices must have cybersecurity features designed and built into them. Multiple vendors are responding with products meant to keep the IoT devices protected from the cyberattacks that are becoming more common. While [getkc id="76" kc_name="IoT"] privacy remains a key concern for consumers and homeowners, IoT security has taken on top-of-mi... » read more

Will 2017 Be The Year Of DDoS?
By Asaf Ashkenazi - 04 Jan, 2017 - Comments: 0

Forrester Research sees a rough year ahead for cyber security. Indeed, targeted espionage, ransomware, denial of service, privacy breaches and more are expected to escalate in 2017. In addition, Forrester Researcher analysts predict that more than 500,000 Internet of Things (IoT) devices will be compromised in 2017. Perhaps not surprisingly, IDC analyst Kevin Lonergan recently warned that Io... » read more

Blog Review: Jan. 4
By Jesse Allen - 04 Jan, 2017 - Comments: 0

Mentor's Harry Foster wraps up his functional verification study series with a look the impact of verification maturity and safety critical designs on first silicon success. Synopsys' David Benas argues for using the insurance industry as a model in assessing the risk of potential software flaws. Cadence's Tom Anderson shares highlights from the recent International Workshop on Microproce... » read more

Blog Review: Dec. 21
By Jesse Allen - 21 Dec, 2016 - Comments: 0

Mentor's Jeff Miller and ARM's Nandan Nayampally contend that it's easier than ever to design custom SoCs. Cadence's Paul McLellan provides a basic primer on silicon photonics, from a presentation by Gilles Lamant. The US Department of Transportation is considering requiring the inclusion of vehicle-to-vehicle communication in new cars, says Synopsys' Robert Vamosi. Applied's Shekar Kr... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 16 Dec, 2016 - Comments: 0

Chipmakers Samsung is mulling over a plan to reorganize its System LSI division, according to a report from BusinessKorea. As part of the move, Samsung is mulling over the idea to spin off its foundry unit, according to the report. A spokeswoman for Samsung’s foundry unit said: “We don't have any comments on this story.” GlobalFoundries has added eight new partners to its FDXcelera... » read more

Blog Review: Dec. 14
By Jesse Allen - 14 Dec, 2016 - Comments: 0

What are the technology options for 5nm? Cadence's Paul McLellan highlights an IEDM presentation by An Steegen of Imec. Synopsys' Michael Posner suggests we may not have to live with USB Type-C dongles for very long. Mentor's Craig Armenti presents some of the fundamental best practices and guidelines for rigid-flex PCB design. NXP's Joe Byrne digs into the Mirai botnet attack, arguing... » read more

Chip Advances Play Big Role In Cloud
By Gale Morrison - 12 Dec, 2016 - Comments: 0

Semiconductor engineering teams have been collaborating with key players in the data center ecosystem in recent years, resulting in unforeseen and substantial changes in how data centers are architected and built. That includes everything from which boxes, boards, cards and cables go where, to how much it costs to run them. The result is that bedrock communication technology and standards li... » read more

What Comes After Moore’s Law And Dennard Scaling?
By Steven Woo - 08 Dec, 2016 - Comments: 0

For decades, Moore’s Law has been an important semiconductor industry mainstay that has helped fuel a relentless progression in computing performance. However, most industry experts agree that Moore’s Law is waning, with an end on the horizon due to a combination of physical limitations and economic factors. With the loss of Dennard Scaling roughly 10 years ago, the industry is at a critica... » read more

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