How to avoid chip failure due to noise.
The market wants mixed ICs that are smaller and cheaper, and even provide advanced features. To satisfy this contradiction, many mixed ICs makers are reducing their bill of materials (BOM) cost by decreasing the amount of materials in the package or on a board. But these cost-effective methods can cause significant performance degradation with intensified coupling effects due to substrate noise. The paper illustrates a case of a chip failure due to coupling noise caused by by ground merge on the package for cost reduction. Included in this illustration is a system aware substrate noise analysis which can reproduce and detect the root cause for the chip failure. Lastly, the paper proposes performance improvement methods designed to also reduce cost.
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