Manufacturing Bits: April 18

By Mark LaPedus - 18 Apr, 2017 - Comments: 0

3D printing on Mars Northwestern University has demonstrated the ability to print 3D-based structures using compounds that resemble Martian and lunar dust. The idea is that if humans begin to colonize the moon and Mars, they may require 3D printers. With 3D printers, humans can make small tools, buildings and other objects. For this, researchers from Northwestern have developed novel in... » read more

Manufacturing Bits: Nov. 8

By Mark LaPedus - 08 Nov, 2016 - Comments: 0

Self-healing magnetic ink The University of California at San Diego has developed a self-healing magnetic ink. The ink can be used to print inexpensive electrochemical devices, such as batteries, sensors, textile-based electrical circuits and other products. A key to the technology is the self-healing concept. This means a device could autonomously repair itself in the field. Over the ye... » read more

Manufacturing Bits: Dec. 29

By Mark LaPedus - 29 Dec, 2015 - Comments: 0

Printing hair Using a low-cost, 3D printing technique, Carnegie Mellon University has found a way to produce hair-like strands and fibers. The printer produces plastic hair strand by strand. It takes about 20-25 minutes to generate hair on 10 square millimeters. A video can be seen here. [caption id="attachment_24544" align="alignleft" width="300"] 3D printed hair (Photo: Carnegie Mellon... » read more

Manufacturing Bits: August 25

By Mark LaPedus - 25 Aug, 2015 - Comments: 0

South Pole neutrinos A group of researchers using an instrument buried deep in the ice at the South Pole have announced a new observation of high-energy neutrinos from beyond our solar system and the galaxy. The IceCube Neutrino Observatory, a cubic-kilometer-sized detector sunk into the ice sheet at the South Pole, allows researchers to see the byproducts of neutrino interactions with the ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: 3D printers

Manufacturing Bits: April 18

Manufacturing Bits: Nov. 8

Manufacturing Bits: Dec. 29

Manufacturing Bits: August 25