7nm Design Challenges


Ty Garibay, CTO at ArterisIP, talks about the challenges of moving to 7nm, who’s likely to head there, how long it will take to develop chips at that node, and why it will be so expensive. This also raises questions about whether chips will begin to disaggregate at 7nm and 5nm. https://youtu.be/ZqCAbH678GE » read more

Week in Review: IoT, Security, Auto


Deals SoftBank Corp. reached an agreement with Indonesia’s Link Net to work together on Internet of Things technology. Hidebumi Kitahara of SoftBank said in a statement, “The global mobile industry is now entering the 5G era, with IoT becoming the central focal point of innovation. This partnership with Link Net shows our strong commitment to further boost technology innovation in the glob... » read more

Market And Tech Inflections Ahead


Aart de Geus, chairman and co-CEO of Synopsys, sat down with Semiconductor Engineering to talk about the path to autonomous vehicles, industry dis-aggregation and re-aggregation, security issues, and who's going to pay for chips at advanced nodes. SE: All of a sudden we have a bunch of new markets opening up for electronics. We have assisted and autonomous driving, AI and machine learning, v... » read more

The Week in Review: IoT


Finance Marvell Technology Group priced $500 million in senior notes due in 2023 and $500 million in senior notes due in 2028. The chip company will use net proceeds from the debt offering, cash on hand, and borrowings under a new term loan facility to fund the cash consideration and other amounts payable for Marvell’s proposed $6 billion acquisition of Cavium. The companies have expected to... » read more

Tech Talk: Connected Intelligence


Gary Patton, CTO at GlobalFoundries, talks about computing at the edge, the slowdown in scaling, and why new materials and packaging approaches will be essential in the future. https://youtu.be/Zbz0R_yFFrQ » read more

The Week in Review: IoT


Tools/Chips Synopsys rolled out a new release of its automotive exterior lighting design and analysis software. The tool calculations and generates images for multiple viewing directions and different lighting conditions. Lighting on vehicles has become far more complex than just shining a beam on the road. The latest technology can adapt to road conditions, other cars, and help illuminate the... » read more

Blazing-Fast Performance


When it comes to raw performance, there's nothing like a supercomputer. Until recently, though, most of this was simply bragging rights about whose supercomputer was faster. A trillion calculations (petaflop), more or less, doesn't mean that much outside of scientific circles. What's changing is that companies and governments now can utilize these blazing fast machines across a wider swath o... » read more

5G Wireless Infrastructure Pushes High-Speed SerDes Protocols


5G is the 5th generation wireless system standard that, through high speeds and increased accessibility, promises to change the way we stream, communicate, work, and travel. Boasting speed capabilities of 20Gbps and network densities of 1 million connected devices per square kilometer, 5G is the required technology for the implementation of highly anticipated technologies like autonomous vehicl... » read more

The Growing Materials Challenge


By Katherine Derbyshire & Ed Sperling Materials have emerged as a growing challenge across the semiconductor supply chain, as chips continue to scale, or as they are utilized in new devices such as sensors for AI or machine learning systems. Engineered materials are no longer optional at advanced nodes. They are now a requirement, and the amount of new material content in chips contin... » read more

Extending The IC Roadmap


An Steegen, executive vice president of semiconductor technology and systems at Imec, sat down with Semiconductor Engineering to discuss IC scaling and chip packaging. Imec is working on next-generation transistors, but it is also developing several new technologies for IC packaging, such as a proprietary silicon bridge, a cooling technology and packaging modules. What follows are excerpts of t... » read more

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