Chip Industry Week In Review

By The SE Staff - 06 Mar, 2026 - Comments: 0

Think tank IAPS' report on AI integrity attacks contends that advanced AI systems must be protected from hidden tampering, backdoors, or unauthorized changes that could alter their behavior or outputs, especially when AI adoption is scaling rapidly, with over 60% of the federal workforce now using AI every day. Geopolitics The U.S. government has drafted new export rules that may give W... » read more

Chip Industry Week In Review

By The SE Staff - 27 Feb, 2026 - Comments: 0

Big Deals and Fundings Rapidus secured US$1.7B in a new funding round from the Japanese government and the private sector to ramp 2nm production by next year. Open AI announced a $110B in new funding, with $30B from Nvidia, $30B from Softbank and $50B from Amazon. In a $100B multi-year deal, Meta will power its AI infrastructure with up to 6GW of AMD's GPUs. SambaNova and Intel ar... » read more

AI Starting To Simplify Design Of Programmable Logic

By Liz Allan - 26 Feb, 2026 - Comments: 0

Key Takeaways AI/ML and agentic tools are getting better at helping design and compile FPGAs, but downstream programming is slower to benefit. FPGAs historically have been designed using Verilog or VHDL, but higher-level languages could push more intelligence into compilers. ML tools can also help with mixed-signal co-design by automatically tuning DSP algorithms based on analog simu... » read more

Chiplets 2026: Where Are We Today?

By Barry Pangrle - 24 Feb, 2026 - Comments: 0

Jim Handy of Objective Analysis and Jawad Nasrullah from Palo Alto Electron kicked off last week's Chiplet Summit with predictions about where the chiplet market is headed and why chiplets are needed to accelerate AI. Handy noted that in the 1990s, multi-chip modules (MCMs) led to mid-'90s multi-chip packages (MCPs), and then progressed to NAND flash stacking, stacked die, big chips (e.g., X... » read more

Chip Industry Week in Review

By The SE Staff - 20 Feb, 2026 - Comments: 0

The IEEE ISSCC conference was held this week in San Francisco. Among the highlights: IBM detailed an AI accelerator based on its new inferencing dataflow architecture. CEA-Leti presented a chip-scale, ultra-fast, battery-operated EPR spectrometer. QuTech introduced a cryo-CMOS SoC with NV centers in diamond. UTokyo showed its low-jitter PLL architecture for beyond 5G/6G. Imec d... » read more

Chip Industry Week In Review

By The SE Staff - 13 Feb, 2026 - Comments: 0

Geopolitics U.S. lawmakers are urging tighter export controls on advanced semiconductor manufacturing equipment (SME) to China, warning existing loopholes threaten national security. "China is working to build domestic SME by exploiting access to U.S. and allied subcomponents required to produce tools," states the letter, which also says better coordination with allies is essential. The U.S.... » read more

Chip Industry Week in Review

By The SE Staff - 06 Feb, 2026 - Comments: 1

Intel hired ex-Qualcomm GPU guru Eric Demers for the company's high-performance GPU push, setting the stage for a three-way battle with Nvidia and AMD. The key targets for Intel and AMD will be better power efficiency and a programming model that rivals CUDA, but don't expect Nvidia to stand still. Acquisitions Texas Instruments plans to acquire Silicon Labs for ~$7.5B cash to enhance i... » read more

Chip Industry Week in Review

By The SE Staff - 16 Jan, 2026 - Comments: 0

Geopolitics Taiwan and the U.S. signed a trade agreement this week, with TSMC and other Taiwanese companies collectively pledging to directly invest at least $250B in investments in advanced semiconductor, energy and AI production and capacity in the U.S. The agreement also included Taiwan providing another $250B in credit guarantees for additional IC supply chain expansions in the U.S., cap... » read more

Chip Industry Week in Review

By The SE Staff - 09 Jan, 2026 - Comments: 0

SIA's latest monthly global semiconductor sales report reflects a ~30% YOY increase, hitting a record $75.3B in November 2025. Asia Pacific had a notable 66% increase. Cadence launched its Chiplet Spec-to-Packaged Parts ecosystem to accelerate time to market for chiplet development for physical AI, data centers, and HPC applications. Initial IP partners joining Cadence include Arm, Arteris, ... » read more

Annual Global IC Fabs And Facilities Report

By Liz Allan - 07 Jan, 2026 - Comments: 0

Semiconductor companies announced a significant number of facilities in 2025 as global onshoring efforts continued across manufacturing, materials, packaging, design, and R&D. Investments came from both industry and government sources. Organizations worked together to solve current technology challenges, including soaring demand for AI chips and advanced memory, as well as complex applic... » read more

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tag: AMD

Chip Industry Week In Review

Chip Industry Week In Review

AI Starting To Simplify Design Of Programmable Logic

Chiplets 2026: Where Are We Today?

Chip Industry Week in Review

Chip Industry Week In Review

Chip Industry Week in Review

Chip Industry Week in Review

Chip Industry Week in Review

Annual Global IC Fabs And Facilities Report

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