Balancing Programmability And Performance In Cars


The rate of change in the automotive industry is accelerating with the shift toward software-defined vehicles and ongoing advancements in algorithms and chip architectures. The challenge now is to figure out the best way to prevent rapid obsolescence, improve safety, and keep the cost of these changes to a minimum. Today, updatable automotive hardware is typically achieved through FPGAs, but... » read more

New AI Processors Architectures Balance Speed With Efficiency


Leading AI systems designs are migrating away from building the fastest AI processor possible, adopting a more balanced approach that involves highly specialized, heterogeneous compute elements, faster data movement, and significantly lower power. Part of this shift revolves around the adoption of chiplets in 2.5D/3.5D packages, which enable greater customization for different workloads and ... » read more

Defining The Chiplet Socket


Experts At The Table: The semiconductor industry has been buzzing with the possibilities surrounding chiplets, but so far this packaging technology has been confined to large semiconductor companies that are vertically integrated. The industry has been attempting to open this up to a broader group of people. To work out what this means for chiplets, and what standardization will be required, Se... » read more

GPU Microarchitecture Integrating Dedicated Matrix Units At The Cluster Level (UC Berkeley)


A new technical paper titled "Virgo: Cluster-level Matrix Unit Integration in GPUs for Scalability and Energy Efficiency" was published by UC Berkeley. Abstract "Modern GPUs incorporate specialized matrix units such as Tensor Cores to accelerate GEMM operations central to deep learning workloads. However, existing matrix unit designs are tightly coupled to the SIMT core, limiting the size a... » read more

A HW-Based Correct Execution Environment Supporting Virtual Memory (Korea U., KAIST)


A new technical paper titled "A Hardware-Based Correct Execution Environment Supporting Virtual Memory" was published by researchers at Korea University, Korea Advanced Institute of Science and Technology and other universities. Abstract "The rapid increase in data generation has led to outsourcing computation to cloud service providers, allowing clients to handle large tasks without inve... » read more

Chip Industry Week In Review


Chinese firms imported almost $26 billion worth of chipmaking machinery, according to fresh trade data released by China’s General Administration of Customs this week, Bloomberg reports. Meanwhile, the global semiconductor manufacturing industry continued to show signs of improvement in Q2 2024 with significant growth of IC sales, stabilizing capital expenditure, and an increase in install... » read more

Chip Industry Week In Review


The U.S. Department of Commerce and Texas Instruments (TI) signed a non-binding preliminary memorandum of terms to provide up to $1.6 billion in CHIPS Act funding towards TI’s investment of over $18 billion for three 300mm semiconductor wafer fabs under construction in Texas and Utah. TI also expects to get about $6 billion to $8 billion from the U.S. Department of Treasury’s Investmen... » read more

Chip Industry Week in Review


Okinawa Institute of Science and Technology proposed a new EUV litho technology using only four reflective mirrors and a new method of illumination optics that it claims will use 1/10 the power and cost half as much as existing EUV technology from ASML. Applied Materials may not receive expected U.S. funding to build a $4 billion research facility in Sunnyvale, CA, due to internal government... » read more

Where Power Savings Really Count


Experts at the Table: Semiconductor Engineering sat down to discuss why and where improvements in architectures and data movement will have the biggest impact, with Hans Yeager, senior principal engineer, architecture, at Tenstorrent; Joe Davis, senior director for Calibre interfaces and EM/IR product management at Siemens EDA; Mo Faisal, CEO of Movellus; Trey Roessig, CTO and senior vice presi... » read more

Chip Industry Week In Review


The U.S. Department of Commerce and Amkor Technology signed a deal to provide up to $400 million in funding, under the CHIPS and Science Act, to build a previously announced end-to-end advanced packaging plant. The combined funding is expected to total about $2 billion. The new facility will add some 2,000 jobs in Peoria, Arizona. The SK hynix Board approved its Yongin Semiconductor Cluster... » read more

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