tag: ARM

Ambient Intelligence eBook
By Arm - 15 May, 2024 - Comments: 0

Get the lowdown on future ambient computing use cases and benefit from simple considerations you can build into your product roadmap today to ensure your platform is ready to capitalise on this burgeoning trend. This tech trends guide covers: Laying the foundations for ambient experiences Future use cases Challenges facing ambient computing use cases Six considerations to addre... » read more

Using AI/ML To Combat Cyberattacks
By John Koon - 09 May, 2024 - Comments: 0

Machine learning is being used by hackers to find weaknesses in chips and systems, but it also is starting to be used to prevent breaches by pinpointing hardware and software design flaws. To make this work, machine learning (ML) must be trained to identify vulnerabilities, both in hardware and software. With proper training, ML can detect cyber threats and prevent them from accessing critic... » read more

Software-Defined Vehicle Momentum Grows
By Ann Mutschler - 09 May, 2024 - Comments: 0

Experts at the Table: The automotive ecosystem is undergoing a transformation toward software-defined vehicles, spurring new architectures with more software. Semiconductor Engineering sat down to discuss the impact of these changes with Suraj Gajendra, vice president of products and solutions in Arm's automotive line of business; Chuck Alpert, R&D automotive fellow at Cadence; Steve Spadon... » read more

Blog Review: May 8
By Jesse Allen - 08 May, 2024 - Comments: 0

Synopsys' Manuel Mota and Michael Posner look to UCIe as a complete stack for the die-to-die interconnect in multi-die chip designs, finding it can help maintain latency while reducing power and enhancing performance along with providing assurance of interoperability. Cadence's Durlov Khan highlights the Octal SPI interface for serial NAND flash, which enables 8-bit wide high bandwidth synch... » read more

Blog Review: May 1
By Jesse Allen - 01 May, 2024 - Comments: 0

Cadence's Vatsal Patel stresses the importance of having testing and training capabilities for high-bandwidth memory to prevent the entire SoC from becoming useless and points to key HBM DRAM test instructions through IEEE 1500. In a podcast, Siemens' Stephen V. Chavez chats with Anaya Vardya of American Standard Circuits about the growing significance of high density interconnect and Ultra ... » read more

Dealing With AI/ML Uncertainty
By Karen Heyman - 25 Apr, 2024 - Comments: 0

Despite their widespread popularity, large language models (LLMs) have several well-known design issues, the most notorious being hallucinations, in which an LLM tries to pass off its statistics-based concoctions as real-world facts. Hallucinations are examples of a fundamental, underlying issue with LLMs. The inner workings of LLMs, as well as other deep neural nets (DNNs), are only partly kno... » read more

Blog Review: April 24
By Jesse Allen - 24 Apr, 2024 - Comments: 0

Cadence's Vatsal Patel notes the factors that make high-bandwidth memory ideal for AI, such as improved bandwidth and area from vertical stacking and power reduction features like data bus inversion. Synopsys' Rob van Blommestein points to early power network analysis as a way to ensure that enough power is delivered to each transistor to mitigate potential power-related issues within the ch... » read more

Chip Industry Week In Review
By The SE Staff - 19 Apr, 2024 - Comments: 0

SK hynix and TSMC plan to collaborate on HBM4 development and next-generation packaging technology, with plans to mass produce HBM4 chips in 2026. The agreement is an early indicator for just how competitive, and potentially lucrative, the HBM market is becoming. SK hynix said the collaboration will enable breakthroughs in memory performance with increased density of the memory controller at t... » read more

Blog Review: April 17
By Jesse Allen - 17 Apr, 2024 - Comments: 0

Siemens' Sumit Vishwakarma highlights the importance of crystal oscillators to the proper functioning of many semiconductor devices and applications, from clock signals to transmission and reception of radio waves. Cadence's Jay Domadia introduces some of the new features in GDDR7, such as a semi-independent row and column command address bus and two modes of data signaling, enabling PAM3 fo... » read more

Architecting Chips For High-Performance Computing
By Ann Mutschler - 15 Apr, 2024 - Comments: 0

The world’s leading hyperscaler cloud data center companies — Amazon, Google, Meta, Microsoft, Oracle, and Akamai — are launching heterogeneous, multi-core architectures specifically for the cloud, and the impact is being felt in high-performance CPU development across the chip industry. It's unlikely that any these chips will ever be sold commercially. They are optimized for specific ... » read more

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