tag: ARM

Chip Industry Week In Review
By The SE Staff - 12 Apr, 2024 - Comments: 0

Applied Materials may scale back or cancel its $4 billion new Silicon Valley R&D facility in light of the U.S. government's recent announcement to reduce funding for construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the United States, according to the San Francisco Chronicle. TSMC could receive up to $6.6 billion in direct funding... » read more

BOLT Optimization Technology Could Bring Obvious Performance Uplift On Arm Server
By Bolt Liu - 11 Apr, 2024 - Comments: 0

BOLT is a post-link optimization technology which builds on LLVM framework, which leverages perf tool to collection sampling data and convert the executable into an optimized version. After evaluating BOLT on several workloads such as MySQL, Redis, memcached and nginx on Arm server, we could see obvious performance uplift. This blog post illustrates the methods used to enable BOLT and per... » read more

Performance Boost In Powerful Real-Time Cortex-R Processor Using Data Prefetch Control
By Arm - 10 Apr, 2024 - Comments: 0

High-performance processors employ hardware data prefetching to reduce the negative performance impact of large main memory latencies. An effective prefetching mechanism can improve cache hit rate significantly. Data prefetching boosts the execution performance by fetching data before it is needed. While prefetching improves performance substantially on many programs, it can significantly red... » read more

Blog Review: April 10
By Jesse Allen - 10 Apr, 2024 - Comments: 0

Cadence's Shyam Sharma looks at the evolution of the LPDDR standard and finds that LPDDR5X is opening new specialized markets for low-power DRAMs beyond the traditional areas of mobile, IoT, and automotive. Siemens' Hossam Sarhan and Dusan Petranovic find that new physical verification approaches are needed to ensure the performance and reliability of superconducting ICs and introduce a hybr... » read more

Chip Industry Week In Review
By The SE Staff - 05 Apr, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan. The Japanese government approved $3.9 billion in funding for chipmaker Rapidus to expand its foundry business, of which 10% will be invested in advanced packaging. This is in addition to the previously announced $2.18 billion in funding. In a meeting next week, the U.S. and Japan are expected to cooperate on increasing semiconductor development a... » read more

Data Center Security Issues Widen
By Adam Kovac - 04 Apr, 2024 - Comments: 0

The total amount of data will swell to about 200 zettabytes of data next year, much of it stored in massive data centers scattered across the globe that are increasingly vulnerable to attacks of all sorts. The stakes for securing data have been rising steadily as the value of that data increases, making it far more attractive to hackers. This is evident in the scope of the attack targets —... » read more

Blog Review: Apr. 3
By Jesse Allen - 03 Apr, 2024 - Comments: 0

Siemens' Keith Felton finds that high bandwidth memory integration poses significant challenges for package designers stemming from its unique architecture and stringent performance requirements. Synopsys' Gervais Fong finds out what's new in the USB4 v2 specification, some of its unique challenges involved in doubling the performance capabilities of the USB wired connection, and an intrigui... » read more

Interconnects Essential To Heterogeneous Integration
By Karen Heyman - 28 Mar, 2024 - Comments: 0

Designing and manufacturing interconnects is becoming more complex, and more critical to device reliability, as the chip industry shifts from monolithic planar dies to collections of chips and chiplets in a package. What was once as simple as laying down a copper trace has evolved into tens of thousands of microbumps, hybrid bonds, through-silicon vias (TSVs), and even junctions for optical ... » read more

Jumpstarting The Automotive Chiplet Ecosystem
By Steve Brown - 28 Mar, 2024 - Comments: 0

The automotive industry stands on the cusp of a technological renaissance, ushering in an era where vehicles aren't just tools of transportation, but interconnected nodes within a vast network of software-defined mobility. Central to this transformation is the concept of chiplets—miniaturized, modular components that can be mixed, matched, and scaled to create powerful, application-specific i... » read more

Blog Review: Mar. 27
By Jesse Allen - 27 Mar, 2024 - Comments: 0

Cadence's Steve Brown suggests that multi-die technologies will be a key part of the path toward a faster, more efficient chip ecosystem that can support the compressed development cycles now emerging in the automotive industry. Synopsys' John Swanson, Madhumita Sanyal, and Priyank Shukla point to the role of simulation in ensuring seamless operation in the Ethernet ecosystem though rigorous... » read more

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