Recent Advances and Challenges in Processing-in-DRAM (ETH Zurich)

By Technical Paper Link - 30 Dec, 2024 - Comments: 0

A new technical paper titled "Memory-Centric Computing: Recent Advances in Processing-in-DRAM" was published by researchers at ETH Zurich. Abstract "Memory-centric computing aims to enable computation capability in and near all places where data is generated and stored. As such, it can greatly reduce the large negative performance and energy impact of data access and data movement, by 1) ... » read more

CXL’s Potential to Elevate The Capabilities of HPC and AI Applications (Micron, Intel)

By Technical Paper Link - 20 Dec, 2024 - Comments: 0

A new technical paper titled "Optimizing System Memory Bandwidth with Micron CXL Memory Expansion Modules on Intel Xeon 6 Processors" was published by researchers at Micron and Intel. Abstract "High-Performance Computing (HPC) and Artificial Intelligence (AI) workloads typically demand substantial memory bandwidth and, to a degree, memory capacity. CXL memory expansion modules, also known... » read more

Baby Steps Toward 3D DRAM

By Bryon Moyer - 17 Dec, 2024 - Comments: 0

Flash memory has made incredible capacity strides thanks to monolithic 3D processing enabled by the stacking of more than 200 layers, which is on its way to 1.000 layers in future generations.[1] But the equally important DRAM has achieved a similar manufacturable 3D architecture. The need for a sufficiently large means of storing charge — such as a capacitor — has proved elusive. Severa... » read more

Redefining XPU Memory For AI Data Centers Through Custom HBM4: Part 1

By Archana Cheruliyil - 26 Nov, 2024 - Comments: 1

This is the first of a three-part series on HBM4 and gives an overview of the HBM standard. Part 2 will provide insights on HBM implementation challenges, and part 3 will introduce the concept of a custom HBM implementation. Relentless growth in data consumption Recent advances in deep learning have had a transformative effect on artificial intelligence (AI) and the ever-increasing volume of ... » read more

Extending The DDR5 Roadmap With MRDIMM

By Zaman Mollah - 14 Nov, 2024 - Comments: 0

Given the voracious memory bandwidth and capacity demands of Gen AI and other advanced workloads, we’ve seen a rapid progression through the generations of DDR5 memory. Multiplexed Registered DIMMs (MRDIMMs) offer a new memory module architecture capable of extending the DDR5 roadmap and expanding the capabilities of server main memory. MRDIMM reuses the lion’s share of existing DDR5 infras... » read more

Distributed Shared Memory That Enlarges Effective Memory Capacity Through Intelligent Tiered DRAM and Storage Management (IIT)

By Technical Paper Link - 13 Nov, 2024 - Comments: 0

A new technical paper titled "MegaMmap: Blurring the Boundary Between Memory and Storage for Data-Intensive Workloads" was published by researchers at Illinois Institute of Technology. "In this work, we propose MegaMmap: a software distributed shared memory (DSM) that enlarges effective memory capacity through intelligent tiered DRAM and storage management. MegaMmap provides workload-aware d... » read more

CXL-Based Heterogeneous Systems: How to Optimize and Future Directions (UCSD, Samsung, SK Hynix)

By Technical Paper Link - 06 Nov, 2024 - Comments: 0

A new technical paper titled "The Hitchhiker’s Guide to Programming and Optimizing CXL-Based Heterogeneous Systems" was published by researchers at UC San Diego, Samsung, SK hynix. Abstract "We present a thorough analysis of the use of CXL-based heterogeneous systems. We built a cluster of server systems that combines different vendor's CPUs and various types of CXL devices. We further ... » read more

GDDR7 Memory Supercharges AI Inference

By Tim Messegee - 17 Oct, 2024 - Comments: 0

GDDR7 is the state-of-the-art graphics memory solution with a performance roadmap of up to 48 Gigatransfers per second (GT/s) and memory throughput of 192 GB/s per GDDR7 memory device. The next generation of GPUs and accelerators for AI inference will use GDDR7 memory to provide the memory bandwidth needed for these demanding workloads. AI is two applications: training and inference. With tr... » read more

Improving The Gate Oxide Reliability in Gate First HKMG DRAM Structures (Sungkyunkwan Univ., Samsung)

By Technical Paper Link - 11 Oct, 2024 - Comments: 0

A new technical paper titled "Novel STI Technology for Enhancing Reliability of High-k/Metal Gate DRAM" was published by researchers at Sungkyunkwan University and Samsung Electronics. Abstract: "The challenges associated with semiconductor are increasing because of the rapid changes in the semiconductor market and the extreme scaling of semiconductors, with some processes reaching their te... » read more

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Shift Left Is The Tip Of The Iceberg

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The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

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eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

tag: DRAM

Top Tech Videos Of 2024

Recent Advances and Challenges in Processing-in-DRAM (ETH Zurich)

CXL’s Potential to Elevate The Capabilities of HPC and AI Applications (Micron, Intel)

Baby Steps Toward 3D DRAM

Redefining XPU Memory For AI Data Centers Through Custom HBM4: Part 1

Extending The DDR5 Roadmap With MRDIMM

Distributed Shared Memory That Enlarges Effective Memory Capacity Through Intelligent Tiered DRAM and Storage Management (IIT)

CXL-Based Heterogeneous Systems: How to Optimize and Future Directions (UCSD, Samsung, SK Hynix)

GDDR7 Memory Supercharges AI Inference

Improving The Gate Oxide Reliability in Gate First HKMG DRAM Structures (Sungkyunkwan Univ., Samsung)

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