Week In Review: Manufacturing, Test

By Ed Sperling - 22 Apr, 2022 - Comments: 0

Onshoring and the supply chain Efforts to patch up supply chain weaknesses by moving more manufacturing onshore in the United States and Europe are generating a lot of buzz. Morris Chang, TMSC's founder, described those moves as "a very expensive exercise in futility," during an interview with the Brookings Institution and Center for Strategic and International Studies, adding that it is like... » read more

Energy Harvesting Starting To Gain Traction

By John Koon - 18 Apr, 2022 - Comments: 4

Tens of billions of IoT devices are powered by batteries today. Depending on the compute intensity and the battery chemistry, these devices can run steadily for short periods of time, or they can run occasionally for decades. But in some cases, they also can either harvest energy themselves, or tap into externally harvested energy, allowing them to work almost indefinitely. Energy harvesting... » read more

Architecting Faster Computers

By Brian Bailey - 14 Apr, 2022 - Comments: 3

To create faster computers, the industry must take a major step back and re-examine choices that were made half a century ago. One of the most likely approaches involves dropping demands for determinism, and this is being attempted in several different forms. Since the establishment of the von Neumann architecture for computers, small, incremental improvements have been made to architectures... » read more

Strategies For Faster Yield Ramps On 5nm Chips

By Laura Peters - 12 Apr, 2022 - Comments: 0

Leading chipmakers TSMC and Samsung are producing 5nm devices in high volume production and TSMC is forging ahead with plans for first 3nm silicon by year end. But to meet such aggressive targets, engineers must identify defects and ramp yield faster than before. Getting a handle on EUV stochastic defects — non-repeating patterning defects such as microbridges, broken lines, or missing con... » read more

Week In Review: Manufacturing, Test

By Ed Sperling - 08 Apr, 2022 - Comments: 0

Deals AMD plans to purchase cloud startup Pensando for about US $1.9 billion. In a presentation at the SEMI ISS conference this week, AMD CTO Mark Papermaster described Pensando's technology as a "highly programmable packet-processing engine that allows you to speed up systems designed for the data center." Intel, Micron, Analog Devices and MITRE Engenuity formed an alliance to accelerate c... » read more

Complex Chips Make Security More Difficult

By John Koon - 07 Apr, 2022 - Comments: 0

Semiconductor supply chain management is becoming more complex with many more moving parts as chips become increasingly disaggregated, making it difficult to ensure where parts originated and whether they have been compromised before they are added into advanced chips or packages. In the past, supply chain concerns largely focused primarily on counterfeit parts or gray-market substitutions u... » read more

Improving Memory Efficiency And Performance

By Bryon Moyer - 28 Mar, 2022 - Comments: 0

This is the second of two parts on CXL vs. OMI. Part one can be found here. Memory pooling and sharing are gaining traction as ways of optimizing existing resources to handle increasing data volumes. Using these approaches, memory can be accessed by a number of different machines or processing elements on an as-needed basis. Two protocols, CXL and OMI, are being leveraged to simplify thes... » read more

Week In Review: Manufacturing, Test

By Ed Sperling - 25 Mar, 2022 - Comments: 0

Worldwide fab equipment spending for front-end manufacturing is expected to hit $107 billion this year, an 18% year-over-year increase, according to SEMI’s latest World Fab Forecast report. “Crossing the $100 billion mark in spending on global fab equipment for the first time is a historic milestone for the semiconductor industry,” said Ajit Manocha, president and CEO of SEMI. Investme... » read more

Planning EDA’s Next Steps

By Ed Sperling - 24 Mar, 2022 - Comments: 0

Anirudh Devgan, Cadence's new CEO, and the recipient of the Phil Kaufman Award in December, sat down with Semiconductor Engineering to talk about what's next in EDA, the underlying technology and business challenges and changes, and new markets that are unfolding for floor-planning, verification, CFD, and advanced packaging. SE: Where does EDA need to improve? Devgan: We have made it much... » read more

Highly Selective Etch Rolls Out For Next-Gen Chips

By Mark LaPedus - 21 Mar, 2022 - Comments: 0

Several etch vendors are starting to ship next-generation selective etch tools, paving the way for new memory and logic devices. Applied Materials was the first vendor to ship a next-gen selective etch system, sometimes called highly-selective etch, in 2016. Now, Lam Research, TEL, and others are shipping tools with highly-selective etch capabilities, in preparation for futuristic devices su... » read more

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Week In Review: Manufacturing, Test

Energy Harvesting Starting To Gain Traction

Architecting Faster Computers

Strategies For Faster Yield Ramps On 5nm Chips

Week In Review: Manufacturing, Test

Complex Chips Make Security More Difficult

Improving Memory Efficiency And Performance

Week In Review: Manufacturing, Test

Planning EDA’s Next Steps

Highly Selective Etch Rolls Out For Next-Gen Chips

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