The Big Shift


The number of chipmakers that truly can differentiate their products by moving to the next process node is falling, and that pool will continue to shrink even further over the next few years. Processor companies such as Intel and IBM always will benefit from scaling and architectural changes. So will GPU companies such as Nvidia, and FPGA vendors such as Xilinx, Microsemi and Altera (now par... » read more

Debug Becomes A Bigger Problem


The EDA industry has invested enormous amounts of time and energy on the verification process, including new languages, new tools, new class libraries, new methodologies. But the one part of the cycle that defines that type of automation is debug. Development teams are spending half of their time in the debug process and the problem is growing. Part of the reason is that design and debug are... » read more

Powerful New Standard


In December the IEEE released the latest version of the 1801 specification, entitled the IEEE standard for design and verification of low-power integrated circuits. Most people know it as UPF, or the Unified Power Format. That was the name the first version of it held while being developed within Accellera. The standard provides a way to specify the power intent associated with a design, enabli... » read more

Predictions For 2016: Tools and Flows


Seventeen companies sent in their predictions for this year with some of them sending predictions from several people. This is in addition to the CEO predictions that were recently published. That is a fine crop of views for the coming year, especially since they know that they will be held accountable for their views and this year, just like the last, they will have to answer for them. We beli... » read more

Debug: Last Bastion Of Automation


There have been a number of times when anecdotal evidence became folk law and then over time, the effort was put in to find out whether there was any truth in it. Perhaps the most famous case is the statement that verification consumes 70% of development time and resources. For years this “fact” was used in almost every verification presentation and yet nobody knew where the number had come... » read more

Why Use A Package?


Subramanian Iyer, distinguished chancellor's professor in UCLA's Electrical Engineering Department—and a former fellow and director of the systems scaling technology department at IBM—sat down with Semiconductor Engineering to talk about the future of chip scaling. What follows are excerpts of that conversation. SE: Advanced packaging is being viewed as a way to extend scaling in the fut... » read more

Bridging Hardware And Software


Methodology and reuse are two fairly standard concepts when it comes to semiconductor design, but they're viewed completely differently by hardware and software teams. It's a given that hardware and software have different goals and opinions about how best to do design. And while all agree that a single methodology can pay dividends in future chips, there is disagreement over who should shap... » read more

What Goes Wrong With IP


Semiconductor Engineering sat down to talk about the future of IP with Rob Aitken, R&D fellow at [getentity id="22186" comment="ARM"]; Mike Gianfagna, vice president of marketing at [getentity id="22242" e_name="eSilicon"]; Judd Heape, vice president of product applications at Apical; and Bernard Murphy, an independent industry consultant. What follows are excerpts of that discussion, which... » read more

EDA, IP Numbers Strong


EDA and IP sales were 7.1% in Q3 across all major segments and all geographical regions, increasing to $1.957 billion compared with $1.828 billion in the same period in 2014, according to just-released numbers from the EDA Consortium. The four-quarter moving average was up 8.8%. "This was an excellent quarter for EDA," said Wally Rhines, board sponsor for the EDA Consortium's Market Statisti... » read more

What Goes Wrong With IP


Semiconductor Engineering sat down to talk about the future of IP with Rob Aitken, R&D fellow at [getentity id="22186" comment="ARM"]; Mike Gianfagna, vice president of marketing at [getentity id="22242" e_name="eSilicon"]; Judd Heape, vice president of product applications at Apical; and Bernard Murphy, an independent industry consultant. What follows are excerpts of that discussion, which... » read more

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