Week In Review: Design, Low Power


The United States Army Research Laboratory is acquiring two new supercomputers, nicknamed Jean and Jay after computing pioneers Jean Jennings Bartik and Kathleen “Kay” McNulty Mauchly, according to an article in NextGov. The two systems are Liqid Computing platforms containing 48 core Intel XEON (Cascade Lake Advanced Performance) processors integrated with the largest solid state file syst... » read more

Testing More To Boost Profits


Not all chips measure up to spec, but as more data becomes available and the cost of these devices continues to rise, there is increasing momentum to salvage and re-purpose chips for other applications and markets. Performance-based binning is as old as color-banded resistors, but the practice is spreading — even for the most advanced nodes and packages. Over the last three decades, engine... » read more

RISC-V Verification Challenges Spread


The RISC-V ecosystem is struggling to keep pace with rapid innovation and customization, which is increasing the amount of verification work required for each design and spreading that work out across more engineers at more companies. The historical assumption is that verification represents 60% to 80% or more of SoC project effort in terms of cost and time for a mature, mainstream processor... » read more

Variation Threat In Advanced Nodes, Packages Grows


Variation is becoming a much bigger and more complex problem for chipmakers as they push to the next process nodes or into increasingly dense advanced packages, raising concerns about the functionality and reliability of individual devices, and even entire systems. In the past, almost all concerns about variation focused on the manufacturing process. What printed on a piece of silicon didn't... » read more

3D NAND’s Vertical Scaling Race


3D NAND suppliers are accelerating their efforts to move to the next technology nodes in a race against growing competition, but all of these vendors are facing an assortment of new business, manufacturing, and cost challenges. Two suppliers, Micron and SK Hynix, recently leapfrogged the competition and have taken the scaling race lead in 3D NAND. But Samsung and the Kioxia-Western Digital (... » read more

Week In Review: Design, Low Power


RISC-V RISC-V International CEO Calista Redmond provided an update on the state of the community during the annual RISC-V Summit: “RISC-V has had an incredible year of growth and momentum. This year, our technical community has grown 66 percent to more than 2,300 individuals in our more than 50 technical and special interest groups. We’re seeing increased market momentum of RISC-V cores, S... » read more

Re-Architecting SerDes


Serializer/Deserializer (SerDes) circuits have been helping semiconductors move data around for years, but new process technologies are forcing it to adapt and change in unexpected ways. Traditionally implemented as an analog circuit, SerDes technology has been difficult to scale, while low voltages, variation, and noise are making it more difficult to yield sufficiently. So to remain releva... » read more

Blog Review: Dec. 9


Arm's Benoit Labbe digs into designing a power converter for Arm Research's ultra-low power M0N0 microcontroller, with a focus on optimal efficiency and leakage constraints. Mentor's Harry Foster tries to get a sense of how much effort is spent in verification of FPGAs by looking at the amount of time spent and number of engineers on a project. Cadence's Paul McLellan listens in as Odile ... » read more

New Security Approaches, New Threats


New and different approaches to security are gaining a foothold as the life expectancy for advanced chips increases, and as emerging technologies such as quantum computing threaten to crack even the most complex encryption schemes. These approaches include everything from homomorphic encryption, where data is processed without being decrypted, to different ways of sending and receiving data ... » read more

Infrastructure Impacts Data Analytics


Semiconductor data analytics relies upon timely, error-free data from the manufacturing processes, but the IT infrastructure investment and engineering effort needed to deliver that data is, expensive, enormous, and still growing. The volume of data has ballooned at all points of data generation as equipment makers add more sensors into their tools, and as monitors are embedded into the chip... » read more

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