The Week in Review: IoT

By Jeff Dorsch - 15 Jun, 2018 - Comments: 0

Tools/Chips Synopsys rolled out a new release of its automotive exterior lighting design and analysis software. The tool calculations and generates images for multiple viewing directions and different lighting conditions. Lighting on vehicles has become far more complex than just shining a beam on the road. The latest technology can adapt to road conditions, other cars, and help illuminate the... » read more

Chip Dis-Integration

By Brian Bailey - 14 Jun, 2018 - Comments: 2

Just because something can be done does not always mean that it should be done. One segment of the semiconductor industry is learning the hard way that continued chip integration has a significant downside. At the same time, another another group has just started to see the benefits of consolidating functionality onto a single substrate. Companies that have been following Moore's Law and hav... » read more

Complexity, Reliability And Cost

By Ed Sperling - 14 Jun, 2018 - Comments: 0

Peter Schneider, director of Fraunhofer's Engineering of Adaptive Systems Division, sat down with Semiconductor Engineering to talk about future challenges in complexity, time to market and reliability issues, advanced packaging architectures, and the impact of billions of connected devices. What follows are excerpts of that discussion. SE: What is the biggest challenge you see in the semico... » read more

Seven Steps To Build A Successful IoT Solution

By Paul Williamson - 14 Jun, 2018 - Comments: 0

The technology sector is on course to produce a trillion connected IoT devices in the next two decades. As an innovator, you want to take advantage of this, but how and where do you begin navigating a complex world of hardware and software choices? The breadth of technology makes it easy for designers to build any kind of IoT solution at any scale across a continuum of applications. W... » read more

The Growing Materials Challenge

By Katherine Derbyshire - 11 Jun, 2018 - Comments: 0

By Katherine Derbyshire & Ed Sperling Materials have emerged as a growing challenge across the semiconductor supply chain, as chips continue to scale, or as they are utilized in new devices such as sensors for AI or machine learning systems. Engineered materials are no longer optional at advanced nodes. They are now a requirement, and the amount of new material content in chips contin... » read more

Tech Talk: 5G Everywhere

By Ed Sperling - 11 Jun, 2018 - Comments: 0

Sarah Yost, senior product marketing manager at National Instruments, talks about the promise of 5G, where it works and where it doesn’t work, and why it’s so critical for so many different markets. https://youtu.be/CzxdrrhSvGY » read more

The Week in Review: IoT

By Jeff Dorsch - 08 Jun, 2018 - Comments: 0

Finance CyberInt raised $18 million in new funding led by Viola Growth and including existing investors. The company provides cybersecurity detection and response services. CyberInt has offices in Israel, the U.S., the United Kingdom, Singapore, and Panama. San Diego-based Kneron, which provides artificial intelligence technology for edge devices, received $18 million in Series A1 funding l... » read more

The Week in Review: IoT

By Jeff Dorsch - 01 Jun, 2018 - Comments: 0

Finance SenseTime of Beijing, China, received $620 million in Series C+ funding, valuing the company at more than $4.5 billion. Alibaba Group led the new funding, as it did with last month’s Series C round of $600 million. Qualcomm, an existing investor, participated in the latest round, along with new investors Fidelity International, Hopu Capital, Silver Lake Partners, and Tiger Global. Se... » read more

The Week In Review: Manufacturing

By Ed Sperling - 01 Jun, 2018 - Comments: 0

Cleanliness is a good thing. In the fab, it's also a very profitable thing. According to a report from Research and Markets, the wafer cleaning systems market will grow more than 6%. The research house notes, however, that the rate of growth is slowing. GlobalFoundries began volume production of its 180nm ultra-high-voltage process for industrial and power applications. The base platform sta... » read more

The Week in Review: IoT

By Jeff Dorsch - 25 May, 2018 - Comments: 0

Finance Orbbec of Shenzhen, China, a developer of motion sensing technology, raised more than $200 million in Series D funding led by Ant Financial. Also participating in the new round were SAIF Financial, Green Pine Capital Partners, R-Z Capital, and Tianlangxing Capital Partners. Established in 2013, Orbbec develops 3D sensors for applications in facial recognition, gesture recognition, robo... » read more

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Knowledge Centers
Entities, people and technologies explored

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tag: IoT

The Week in Review: IoT

Chip Dis-Integration

Complexity, Reliability And Cost

Seven Steps To Build A Successful IoT Solution

The Growing Materials Challenge

Tech Talk: 5G Everywhere

The Week in Review: IoT

The Week in Review: IoT

The Week In Review: Manufacturing

The Week in Review: IoT