DDR5 12.8Gbps MRDIMM IP: Powering The Future Of AI, HPC, And Data Centers

By Kos Gitchev - 12 Sep, 2024 - Comments: 0

The demand for higher-performance computing is greater than ever. Cutting-edge applications in artificial intelligence (AI), big data analytics, and databases require high-speed memory systems to handle the ever-increasing volumes and complexities of data. Advancements in cloud computing and machine virtualization are stretching the limits of current capabilities. AI applications hosted in the ... » read more

GDDR7: The Ideal Memory Solution In AI Inference

By Frank Ferro - 29 Aug, 2024 - Comments: 1

The generative AI market is experiencing rapid growth, driven by the increasing parameter size of Large Language Models (LLMs). This growth is pushing the boundaries of performance requirements for training hardware within data centers. For an in-depth look at this, consider the insights provided in "HBM3E: All About Bandwidth". Once trained, these models are deployed across a diverse range of... » read more

Memory Implications Of Gen AI In Gaming

By Tim Messegee - 08 Aug, 2024 - Comments: 0

The global gaming market across hardware, software and services is on track to exceed annual revenues of $500B in 2025.1 That’s bigger by an order of magnitude than the combination of movies and music. On the cutting edge of that enormous market is open world gaming, where the driving goal is to give players the freedom to do anything they can imagine in a coherent and immersive environment. ... » read more

Are You Ready For HBM4? A Silicon Lifecycle Management (SLM) Perspective

By Faisal Goriawalla - 06 Aug, 2024 - Comments: 0

Many factors are driving system-on-chip (SoC) developers to adopt multi-die technology, in which multiple dies are stacked in a three-dimensional (3D) configuration. Multi-die systems may make power and thermal issues more complex, and they have required major innovations in electronic design automation (EDA) implementation and test tools. These challenges are more than offset by the advantages... » read more

LPDDR Memory Is Key For On-Device AI Performance

By Nidish Kamath - 24 Jun, 2024 - Comments: 1

Low-Power Double Data Rate (LPDDR) emerged as a specialized high performance, low power memory for mobile phones. Since its first release in 2006, each new generation of LPDDR has delivered the bandwidth and capacity needed for major shifts in the mobile user experience. Once again, LPDDR is at the forefront of another key shift as the next wave of generative AI applications will be built into ... » read more

The Importance Of Memory Encryption For Protecting Data In Use

By Emma-Jane Crozier - 06 Jun, 2024 - Comments: 0

As systems-on-chips (SoCs) become increasingly complex, security functions must grow accordingly to protect the semiconductor devices themselves and the sensitive information residing on or passing through them. While a Root of Trust security solution built into the SoCs can protect the chip and data resident therein (data at rest), many other threats exist which target interception, theft or t... » read more

How To Successfully Deploy GenAI On Edge Devices

By Gordon Cooper - 16 May, 2024 - Comments: 0

Generative AI (GenAI) burst onto the scene and into the public’s imagination with the launch of ChatGPT in late 2022. Users were amazed at the natural language processing chatbot’s ability to turn a short text prompt into coherent humanlike text including essays, language translations, and code examples. Technology companies – impressed with ChatGPT’s abilities – have started looking ... » read more

DDR5 PMICs Enable Smarter, Power-Efficient Memory Modules

By Tim Messegee - 16 May, 2024 - Comments: 0

Power management has received increasing focus in microelectronic systems as the need for greater power density, efficiency and precision have grown apace. One of the important ongoing trends in service of these needs has been the move to localizing power delivery. To optimize system power, it’s best to deliver as high a voltage as possible to the endpoint where the power is consumed. Then a... » read more

Research Bits: May 7

By Jesse Allen - 07 May, 2024 - Comments: 0

High-temperature memory Researchers from the University of Pennsylvania and Air Force Research Laboratory demonstrated memory technology capable of enduring temperatures as high as 600° Celsius for more than 60 hours while retaining stability and reliability. The non-volatile memory device consists of a metal–insulator–metal structure, incorporating nickel and platinum electrodes with a 4... » read more

Powering The Automotive Revolution: Advanced Packaging For Next-Generation Vehicle Computing

By Prasad Dhond - 18 Apr, 2024 - Comments: 0

Automotive processors are rapidly adopting advanced process nodes. NXP announced the development of 5 nm automotive processors in 2020 [1], Mobileye announced EyeQ Ultra using 5 nm technology during CES 2022 [2], and TSMC announced its “Auto Early” 3 nm processes in 2023 [3]. In the past, the automotive industry was slow to adopt the latest semiconductor technologies due to reliability conc... » read more

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DDR5 12.8Gbps MRDIMM IP: Powering The Future Of AI, HPC, And Data Centers

GDDR7: The Ideal Memory Solution In AI Inference

Memory Implications Of Gen AI In Gaming

Are You Ready For HBM4? A Silicon Lifecycle Management (SLM) Perspective

LPDDR Memory Is Key For On-Device AI Performance

The Importance Of Memory Encryption For Protecting Data In Use

How To Successfully Deploy GenAI On Edge Devices

DDR5 PMICs Enable Smarter, Power-Efficient Memory Modules

Research Bits: May 7

Powering The Automotive Revolution: Advanced Packaging For Next-Generation Vehicle Computing

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