Week In Review: System-Level Design

By Ed Sperling - 07 Feb, 2014 - Comments: 0

Cadence agreed to buy Forte Design Systems for an undisclosed sum, adding further proof that the market for high-level synthesis and tools that run at higher levels of abstraction is finally hitting its stride. Behind this acquisition is a rising pain level due to increasing complexity in SoCs—IP integration, low power concerns and much more of everything, from transistors to memories—has f... » read more

Buying And Selling EDA Companies

By Ed Sperling - 26 Sep, 2013 - Comments: 0

By Ed Sperling Buying companies is the easy part. Integrating them is the hard part. It’s also the point where most acquisitions that go awry actually run into problems. There are widely different strategies for how to accomplish integration. Sometimes they work, other times they don’t. And sometimes both companies are surprised by the outcome—for better or worse. “Either you thi... » read more

Under One Roof

By Ed Sperling - 12 Sep, 2013 - Comments: 0

By Ed Sperling Microsoft’s decision to buy Nokia’s phone business, Apple’s move to build its own chips to more effectively run its software, and Google’s effort to develop its own hardware for next-generation platforms such as Google Glass mark an interesting reversal in the electronics industry. Disaggregation was the answer to slow-moving giants such as big-iron companies. Startin... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: acquisitions

Week In Review: System-Level Design

Buying And Selling EDA Companies

Under One Roof