tag: advanced packaging interposers

A High-Capacity Solution for Power and Signal Integrity on 2.5D Silicon Interposers

By Ansys - 12 Jun, 2024 - Comments: 0

The present trends in technology — such as increasing demand for computational power from CPUs and GPUs, connectivity driven by Internet of Things (IoT), data demands around connected and self-driving cars, and the design of processors optimized for artificial intelligence (AI) — require more functionality from integrated circuits. As designers struggle to find ways to scale with complexity... » read more

Trending Articles

Controlling Warpage In Advanced Packages

Mechanical stresses increase with larger sizes and heterogeneous materials.

by Laura Peters

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Much of the hardware is the same, but AI systems have unique vulnerabilities that require novel defense strategies.

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DAC; CHIPS funding; CXL standards; Nexperia investment; US curbs tech investments; Accellera's Federated Simulation Group; European sustainability concerns; SIA's tracking tool; Multibeam's multicolumn litho system.

by The SE Staff

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Addressing energy consumption has become a requirement as AI takes root, but it requires changes across the entire ecosystem.

by Ann Mutschler

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by The SE Staff

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