Week in Review: IoT, Security, Auto

By Jeff Dorsch - 07 Dec, 2018 - Comments: 0

Internet of Things DHL Supply Chain reports that it will spend $300 million to install Internet of Things sensors and collaborative robots in its North American warehouses, bringing 60% of those facilities up to automation capabilities already implemented in 85 of DHL’s 430 warehouses in North America. The company will also employ robotic process automation software and other programs to red... » read more

NIWeek on Offer in May

By Jeff Dorsch - 07 May, 2018 - Comments: 0

National Instruments is putting on its annual NIWeek conference and exhibition this month, May 21-24 at the Austin Convention Center in the capital of Texas. Details on the agenda and the full four-day program are available here. I’ve attended NIWeek for the past two years, and it’s an opportunity to learn new things, see impressive product demonstrations, and hear about developments ... » read more

System Bits: April 3

By Ann Mutschler - 03 Apr, 2018 - Comments: 0

Investigating the human brain for quantum computation potential While much has been made of quantum computing processes using ultracold atoms and ions, superconducting junctions and defects in diamonds, researchers are questioning if this could be performed in human brains. In fact, UC Santa Barbara theoretical physicist Matthew Fisher has been asking this question for years. And now as scient... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: advanced robotics

Week in Review: IoT, Security, Auto

NIWeek on Offer in May

System Bits: April 3