First Time Success And Cost Control

By Brian Bailey - 26 Feb, 2015 - Comments: 0

First time success has been the ultimate goal for semiconductor companies due to escalating mask costs, as well as a guiding objective for the development of EDA tools, especially in the systems and verification space. These pressures are magnified for the [getkc id="76" comment="Internet of Things"] (IoT), especially the edge devices. Have system-level tools been able to contribute to first ti... » read more

What Will Change In Design For 2015?

By Brian Bailey - 15 Jan, 2015 - Comments: 0

This year more than 26 people provided predictions for 2015. Most of these came from the EDA industry, so the results may be rather biased. However, ecosystems are coming closer together in many parts of the semiconductor food chain, meaning that the EDA companies often can see what is happening in dependent industries and in the system design houses. Thus their predictions may have already res... » read more

Industry Collaboration Starts

By Jesse Allen - 07 Nov, 2014 - Comments: 0

Last week was quite exciting for the Knowledge Center. We have started to receive our first vendor supplied pages along with obtaining permission to mine various documents for populating other pages. A big thank you for these early contributions. Several people also sent in photographs for inclusion on their personal pages as well as additional information or corrections. It all started whe... » read more

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Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: agile development

First Time Success And Cost Control

What Will Change In Design For 2015?

Industry Collaboration Starts