2030 Data Center AI Chip Winners: The Trillion Dollar Club


At the start of 2025, I believed AI was overhyped, ASICs were a niche, and a market pullback was inevitable. My long-term view has changed dramatically. AI technology and adoption is accelerating at an astonishing pace. One of the GenAI/LLM leaders, or Nvidia, will be the first $10 Trillion market cap company by 2030. Large language models (LLMs) are rapidly improving in both capability and ... » read more

AI For The Edge: Why Open-Weight Models Matter


The rapid advancements in AI have brought powerful large language models (LLMs) to the forefront. However, most high-performing models are massive, compute-heavy, and require cloud-based inference, making them impractical for edge computing. The recent release of DeepSeek-R1 is an early, but unlikely to be the only, example of how open-weight AI models, combined with efficient distillation t... » read more

The Rise Of Generative AI On The Edge


Artificial intelligence (AI) and machine learning (ML) have undergone significant transformations over the past decade. The revolution of convolutional neural networks (CNNs) and recurrent neural networks (RNNs) is evolving toward the adoption of transformers and generative AI (GenAI), marking a pivotal shift in the field. This transition is driven by the need for more accurate, efficient, and ... » read more

How Physical AI Is Redefining The Automotive Industry


The automotive world is experiencing a groundbreaking transformation, with technology and AI-driven innovation at its core. Among the most significant advancements is the rise of physical AI, a concept that is redefining the industry from the ground up. Physical AI goes beyond traditional artificial intelligence by enabling autonomous systems to seamlessly perceive, understand, and interact wit... » read more

Times Are Changing For EDA


The EDA industry is about 50 years old, and I see the people responsible for its first generation setting their LinkedIn employment status to 'retired, at home' almost daily. I, for one, have a foot in that camp, but reporting/writing is different than having a full-time job because I can control the time commitment. We have seen many serial entrepreneurs who have created several successful com... » read more

How AI And Connected Workflows Will Close The Verification Bottleneck


For decades, verification has been the unsung hero of chip development—quietly catching bugs before they reach silicon. But as semiconductor complexity has skyrocketed, verification has turned into the bottleneck of development cycles. This challenge has a name: Verification Productivity Gap 2.0. Back in the early 2000s, the Verification Productivity Gap 1.0 emerged when design complexi... » read more

Unleashing AI Potential Through Advanced Chiplet Architectures


The rapid proliferation of machine-generated data is driving unprecedented demand for scalable AI infrastructure, placing extreme pressure on compute and connectivity within data centers. As the power requirements and carbon footprint of AI workloads rise, there is a critical need for efficient, high-performance hardware solutions to meet growing demands. Traditional monolithic ICs will not sca... » read more

The Evolving Role Of AI In Verification


Experts At The Table: The pressure on verification engineers to ensure the functional correctness of devices has increased exponentially as chips have gotten more complex and evolved into SoC, 3D-ICs, multi-die chiplets and beyond. Semiconductor Engineering sat down with a panel of experts, which included Josh Rensch, director of application engineering at Arteris; Matt Graham, senior group dir... » read more

Big Changes Ahead For Interposers And Substrates


Interposers and substrates are undergoing a profound transformation from intermediaries to engineered platforms responsible for power distribution, thermal management, high-density interconnects, and signal integrity in the most advanced computing systems. This shift is being driven by AI, high-performance computing (HPC), and next-generation communications, where the need for heterogeneous ... » read more

TCAD-Based AI Models For Modern Fab Workflows


The relentless pace of semiconductor development continues unabated. Despite the slowdown in Moore’s law, feature sizes continue to shrink as new geometries come online. Constant innovations in both fab processes and device design offer new opportunities but present new challenges. As in so many other areas of electronics, artificial intelligence (AI) is starting to play a significant role. ... » read more

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