The Week In Review: Manufacturing

By Mark LaPedus - 25 Sep, 2015 - Comments: 0

Samsung Semiconductor unveiled its North American R&D Headquarters for its Device Solutions group in San Jose, Calif. The new campus is a 1.1 million-square-foot R&D, sales and marketing center. Is 5G the next big thing in wireless? Verizon–the first company to introduce 4G LTE–is once again poised to usher in a new era with an aggressive roadmap for fifth-generation, or 5G, wireless t... » read more

The Wi Of CES

By Ed Sperling - 26 Jan, 2012 - Comments: 0

By Pallab Chatterjee There has already been quite a bit written about the tablets, TVs and ultrabooks that consumed most of the floor space at this year’s CES show in Las Vegas. There was an underlying technology that was brought out at the show to bind these together—wireless. As the proliferation of content consumption device continues, creating a connected network to get this media a... » read more

LTE Heightens Power-Consumption Concerns

By Ed Sperling - 11 Mar, 2010 - Comments: 0

By Ellen Konieczny The air interface dubbed Long Term Evolution (LTE) hails the coming of fourth-generation (4G) cellular communications, which will benefit from both increased capacity and speed. Among the lofty goals of 4G technology is the promise of users being able to widely access streaming media, such as mobile television and video, in real time. Before such capabilities can be made ava... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Alcatel-Lucent

The Week In Review: Manufacturing

The Wi Of CES

LTE Heightens Power-Consumption Concerns

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Entities, people and technologies explored