tag: AlleyCorp

Startup Funding: Q1 2025

By Jesse Allen - 02 Apr, 2025 - Comments: 0

The first quarter of 2025 saw six companies raise at least $100 million in investment. Of those, three went to quantum hardware companies, with major investment into neutral atom, superconducting, and hybrid quantum control approaches. AI chips and enabling technology were another big winner in the quarter, with companies developing optical communications tech for chips and data center infra... » read more

Startup Funding: December 2023

By Jesse Allen - 10 Jan, 2024 - Comments: 0

Photonics and optics were strong in December, with investors funding two different companies using photonic technologies to develop AI chips and interconnects. Another key area — metaoptics — combines what traditionally would be separate lenses and optical components into a single, flat nanopatterned device. Metaoptics are being deployed in applications ranging from AI processing and sensor... » read more

Startup Funding: December 2022

By Jesse Allen - 04 Jan, 2023 - Comments: 0

The month of December saw six rounds of $100 million or more. The largest, at a massive half-billion dollars, will support manufacturing of 12-inch monocrystalline silicon polished wafers and epitaxial wafers in China. The company is aiming for a production rate of 1 million pieces a month when current expansion is completed. Also in the half-billion club last month is a company making auton... » read more

Trending Articles

Startup Funding: Q1 2025

AI chips and data center communications see big funding; 75 startups raise $2 billion.

Advanced Packaging Fundamentals for Semiconductor Engineers

New SE eBook examines the next phase of semiconductor design, testing, and manufacturing.

Chip Industry Week In Review

Tariff questions, impact; global sales report; Europe's chiplets focus; DARPA's quantum push; Intel 18A enters risk production; optical networking bonanza; new wafer probe test; inference benchmark results; UMC opens 22nm fab in Singapore.

by The SE Staff

Chiplet Tradeoffs And Limitations

Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on power, performance, and cost.

by Ann Mutschler

2030 Data Center AI Chip Winners: The Trillion Dollar Club

Data center will be >50% of semis; CSPs/OpenAI, Nvidia, TSMC, Broadcom are best positioned

Knowledge Centers
Entities, people and technologies explored

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Startup Funding: Q4 2024

AI chips and interconnects end year on high note; $3 billion for 75 companies.

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Linear Pluggable Optics Save Energy In Data Centers

New OIF electrical standards will enable interoperability, adding another option for faster and more efficient data movement.

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Chip Architectures Becoming Much More Complex With Chiplets

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What’s Next For Through-Silicon Vias

Fab tools are being fine-tuned for TSV processes as demand ramps for everything from HBM to integrated RF, power, and MEMS in 3D packaging.

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