Chip Industry Week In Review


Amkor will provide turnkey advanced packaging and test services to TSMC in Amkor's planned facility in Peoria, Arizona, in a deal announced on Thursday. The companies jointly specified the packaging technologies, such as TSMC’s Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS). President Biden signed into law a bill that exempts some semiconductor projects funded by the U.S.... » read more

Chip Industry Week In Review


Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, according to SEMI. Key drivers are the regionalization of semiconductor fabs and the increasing demand for AI chips in data centers and edge devices, with China, South Korea, and Taiwan leading the way. The Biden-Harris Administration launched the National Semiconductor Technology Center’... » read more

Chip Industry Week in Review


Okinawa Institute of Science and Technology proposed a new EUV litho technology using only four reflective mirrors and a new method of illumination optics that it claims will use 1/10 the power and cost half as much as existing EUV technology from ASML. Applied Materials may not receive expected U.S. funding to build a $4 billion research facility in Sunnyvale, CA, due to internal government... » read more

Chip Industry Week In Review


BAE Systems and GlobalFoundries are teaming up to strengthen the supply of chips for national security programs, aligning technology roadmaps and collaborating on innovation and manufacturing. Focus areas include advanced packaging, GaN-on-silicon chips, silicon photonics, and advanced technology process development. Onsemi plans to build a $2 billion silicon carbide production plant in the ... » read more

Chip Industry Week In Review


Rapidus and IBM are jointly developing mass production capabilities for chiplet-based advanced packages. The collaboration builds on an existing agreement to develop 2nm process technology. Vanguard and NXP will jointly establish VisionPower Semiconductor Manufacturing Company (VSMC) in Singapore to build a $7.8 billion, 12-inch wafer plant. This is part of a global supply chain shift “Out... » read more

Will Chiplet Adoption Mimic IP Adoption?


If we look at the semiconductor industry expansion during the last 25 years, adoption of design IP in every application appears to be one of the major factors of success, with silicon technology incredible development by a x100 factor, from 250nm in 2018 to 3nm (if not 2nm) in 2023. We foresee the move to chiplet-based architecture to soon play the same role that SoC chip-based architecture and... » read more

SRAM’s Role In Emerging Memories


Experts at the Table — Part 3: Semiconductor Engineering sat down to talk about AI, the latest issues in SRAM, and the potential impact of new types of memory, with Tony Chan Carusone, CTO at Alphawave Semi; Steve Roddy, chief marketing officer at Quadric; and Jongsin Yun, memory technologist at Siemens EDA. What follows are excerpts of that conversation. Part one of this conversation can be ... » read more

The Uncertain Future Of In-Memory Compute


Experts at the Table — Part 2: Semiconductor Engineering sat down to talk about AI and the latest issues in SRAM with Tony Chan Carusone, chief technology officer at Alphawave Semi; Steve Roddy, chief marketing officer at Quadric; and Jongsin Yun, memory technologist at Siemens EDA. What follows are excerpts of that conversation. Part one of this conversation can be found here and part 3 is h... » read more

AI Races To The Edge


AI is becoming increasingly sophisticated and pervasive at the edge, pushing into new application areas and even taking on some of the algorithm training that has been done almost exclusively in large data centers using massive sets of data. There are several key changes behind this shift. The first involves new chip architectures that are focused on processing, moving, and storing data more... » read more

Week In Review: Manufacturing, Test


Chipmakers, OEMs Intel continues to build more fabs. First, the company announced fabs in Arizona and then Ohio. Now, Intel plans to invest up to €80 billion in the European Union over the next decade. As part of the effort, Intel plans to build two semiconductor fabs in Magdeburg, Germany. Construction is expected to begin in the first half of 2023 and production planned to come online in 2... » read more

← Older posts