The Week In Review: Design/IoT

By Jesse Allen - 18 Sep, 2015 - Comments: 0

M&A Mentor Graphics acquired the rest of Calypto. In 2011, Mentor sold Calypto their high-level synthesis solution – Catapult – in exchange for 51% of the company, but left it as a fully standalone entity. Calypto will now be merged into Mentor as a standalone business unit. Tools Synopsys released its HAPS-80 FPGA-based prototyping system. According to Synopsys, the system pro... » read more

EDA Forecast: More Clouds

By Ed Sperling - 24 Feb, 2011 - Comments: 0

By Ed Sperling Design engineers and EDA vendors used to scoff at the idea of cloud-based tools, but no one is scoffing anymore. A decade after the idea of renting tools online fell flat, largely due to security concerns by chipmakers, all three of the major EDA players and some smaller rivals are taking cloud-based solutions very seriously again. There are several reasons for this change... » read more

Cloud Seeding

By Ed Sperling - 18 Feb, 2011 - Comments: 0

Selling EDA through a software-as-a-service model is hardly a new concept. It’s also not a particularly successful one. Despite some initial hype and sporadic attempts to revive it, the idea has fallen flat due to concerns about version control, security and an almost universal aversion to engineers having to send large files back and forth to a server. The approach is getting a new look, ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Altium

The Week In Review: Design/IoT

EDA Forecast: More Clouds

Cloud Seeding