Will PAYGO Shake Up How We Pay for Chips?

By Bryon Moyer - 05 Aug, 2021 - Comments: 0

System builders are used to buying integrated circuits on a simple transactional basis — the chip has a price, and that’s what you pay. But some application spaces may have a wide variety of capabilities that need hardware support, and each feature may not be used for every instance. Traditionally, one would design different chips for different feature mixes and price points. But a new p... » read more

Configuring AI Chips

By Ed Sperling - 04 Jun, 2021 - Comments: 0

Change is almost constant in AI systems. Vinay Mehta, technical product marketing manager at Flex Logix, talks about the need for flexible architectures to deal with continual modifications in algorithms, more complex convolutions, and unforeseen system interactions, as well as the ability to apply all of this over longer chip lifetimes. Related Dynamically Reconfiguring Logic A differ... » read more

Amazon Fire And The Importance Of Interface Design

By Brian Fuller - 10 Jul, 2014 - Comments: 0

The flames have died down a bit from the red-hot coverage of the launch of the Amazon Fire smart phone, but the impact of the announcement lingers for me. Love or hate Amazon (I love the company), you have to tip your hat to CEO Jeff Bezos. He’s redefined smart phone design with this offering and in the process forced our industry to think about how we support system designers like Amazon. ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: application-specific design

Will PAYGO Shake Up How We Pay for Chips?

Configuring AI Chips

Amazon Fire And The Importance Of Interface Design