Manufacturing Bits: Aug. 19


28nm brain chips DARPA-funded researchers have developed a 28nm chip that mimics the brain. The low-power chip is inspired by the neuronal structure of the brain. Designed by researchers at IBM under DARPA’s Systems of Neuromorphic Adaptive Plastic Scalable Electronics (SyNAPSE) program, the chip consists of 5.4 billion transistors. Built on Samsung’s 28nm foundry process, the chip has ... » read more

Manufacturing Bits: July 29


Measuring hydrogen fuel for cars The use of fuel cells to power cars and buses is still in its infancy. Fuel cell vehicles are electric-based systems powered by hydrogen. A fuel cell uses a certain type of proton exchange membrane (PEM). The PEM fuel cells are stacked together to form a fuel cell stack. All told, fuel cell systems are about 60% efficient, or roughly two to three times more ... » read more

Manufacturing Bits: June 3


World’s thinnest TFTs The U.S. Department of Energy’s Argonne National Laboratory has devised the world’s thinnest flexible, 2D thin-film transistors (TFTs). The transistors are just 10 atomic layers thick. TFTs are typically used in screens and displays. In the lab, Argonne researchers fabricated the TFTs on both a conventional silicon platform and a flexible substrate. [caption i... » read more

Manufacturing Bits: Feb. 11


Monolithic 3D SRAM project A group of companies have started a research project to propel the development of monolithic 3D chip technology. The research project, called COMPOSE³, involves the ability to stack transistors vertically. Within three years, the group hopes to unveil a proof of concept for building the world’s first 14nm, 3D-stacked SRAM cell based on III-V materials. Co... » read more

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