Manufacturing Bits: July 29

By Mark LaPedus - 29 Jul, 2014 - Comments: 2

Measuring hydrogen fuel for cars The use of fuel cells to power cars and buses is still in its infancy. Fuel cell vehicles are electric-based systems powered by hydrogen. A fuel cell uses a certain type of proton exchange membrane (PEM). The PEM fuel cells are stacked together to form a fuel cell stack. All told, fuel cell systems are about 60% efficient, or roughly two to three times more ... » read more

Manufacturing Bits: June 3

By Mark LaPedus - 03 Jun, 2014 - Comments: 0

World’s thinnest TFTs The U.S. Department of Energy’s Argonne National Laboratory has devised the world’s thinnest flexible, 2D thin-film transistors (TFTs). The transistors are just 10 atomic layers thick. TFTs are typically used in screens and displays. In the lab, Argonne researchers fabricated the TFTs on both a conventional silicon platform and a flexible substrate. [caption i... » read more

Manufacturing Bits: Feb. 11

By Mark LaPedus - 11 Feb, 2014 - Comments: 1

Monolithic 3D SRAM project A group of companies have started a research project to propel the development of monolithic 3D chip technology. The research project, called COMPOSE³, involves the ability to stack transistors vertically. Within three years, the group hopes to unveil a proof of concept for building the world’s first 14nm, 3D-stacked SRAM cell based on III-V materials. Co... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Argonne

Manufacturing Bits: July 29

Manufacturing Bits: June 3

Manufacturing Bits: Feb. 11