Are You Ready For AI?


The semiconductor industry sits at the heart of the artificial intelligence revolution, providing the essential computational foundation that powers AI's rapid evolution. However, new research suggests that while AI adoption is accelerating globally, strategic implementation remains a significant challenge across industries. According to the recently released Arm AI Readiness Index Report, 8... » read more

Chiplet Tradeoffs And Limitations


The semiconductor industry is buzzing with the benefits of chiplets, including faster time to market, better performance, and lower power, but finding the correct balance between customization and standardization is proving to be more difficult than initially thought. For a commercial chiplet marketplace to really take off, it requires a much deeper understanding of how chiplets behave indiv... » read more

3D-IC Ecosystem Starts To Take Form


The adoption of chiplets is inevitable, but exactly when a mass migration toward this design approach will begin is yet to be determined. Nevertheless, some of the biggest technological and business-related barriers are being addressed. And while a chiplet-based design remains beyond the economic reach of many companies today, that is starting to change. Early signs of an emerging ecosystem ... » read more

Arm AI Readiness Index


The Arm AI Readiness Index report is a comprehensive analysis of global AI readiness and implementation for enterprises worldwide. Drawing on survey data from business leaders across eight countries, the report offers a range of insights exploring the global opportunities and challenges around AI, including: Business adoption Technology requirement The policy and regulatory landscape... » read more

Blog Review: Apr. 2


Synopsys’ Meenakshy Ramachandran explores how DisplayPort Automotive Extensions help meet functional safety and security standards for the increasingly higher-resolution and more immersive in-vehicle displays in connected, autonomous, shared, and electric vehicles. Siemens’ Gabriella Leone and Michael Munsey discuss the need for a collaborative semiconductor business platform and how to ... » read more

Virtualizer Native Execution Accelerates Software Defined Product Development for Arm Solutions


This whitepaper highlights advancements in virtual prototyping with near native execution performance. The adoption of Arm processor architecture in automotive and data centers is driven by software complexity and ECU consolidation. This shift elevates virtualization performance requirements, supported by Arm's mature software ecosystem. Key Takeaways: Adoption of and convergence of bot... » read more

Blog Review: Mar. 26


Siemens' Bianca Ward argues that sustainability must be considered starting from the design phase to reduce the energy consumption of ICs as well as the production processes used to manufacture them. Synopsys' Adrien Tozzoli looks at how physical optics simulation can be improved by using beam synthesis propagation, a method that decomposes the optical field into a collection of beamlets to ... » read more

Chip Industry Week In Review


Semiconductor industry energy consumption grew 125% between 2015 and 2023, while direct greenhouse gas emissions rose 23% in the same period, according to the Europe think tank Interface, which analyzed corporate social responsibility reports from 28 global chip manufacturers. CSIS' new report "Understanding U.S. Allies’ Current Legal Authority to Implement AI and Semiconductor Export Cont... » read more

What Exactly Are Chiplets And Heterogeneous Integration?


The terms “chiplet” and “heterogeneous integration” fill news pages, conference papers, and marketing presentations, and for the most part engineers understand what they're reading. But speakers sometimes stumble during a presentation trying to figure out whether a particular die qualifies as a chiplet, and heterogeneous integration comes in different guises for different people. Both t... » read more

Blog Review: Mar. 19


Cadence's Neelabh Singh explains the defined port operations of USB4 that are used to bring transmitters burst and receivers of a design under test into compliance mode and to execute tests like bit error tests, error rate tests, clock switch tests, TxFFE equalization tests, and electrical idle tests. Siemens EDA's Stephen V. Chavez examines the use of blind and buried vias in high-density i... » read more

← Older posts