tag: ARM

Signal Integrity Plays Increasingly Critical Role In Chiplet Design
By Ann Mutschler - 13 Feb, 2025 - Comments: 0

Maintaining the quality and reliability of electrical signals as they travel through interconnects is proving to be much more challenging with chiplets and advanced packaging than in monolithic SoCs and PCBs. Signal integrity is a fundamental requirement for all chips and systems, but it becomes more difficult with chiplets due to reflections, loss, crosstalk, process variation, and various ... » read more

Building Vision-Enabled Devices To Capture The Emerging Wave In IoT
By Diya Soubra - 13 Feb, 2025 - Comments: 0

The evolution of vision (the eye) is considered one of the most significant events in the history of life on Earth. 540 million years ago, during the Cambrian period, there was a sudden burst of evolutionary activity that resulted in the appearance of a variety of new species. Many of these species were characterized by the development of an eye which allowed them to perceive and interact with ... » read more

Automotive Outlook 2025: Ecosystem Pivots Around SDV
By Ann Mutschler - 06 Feb, 2025 - Comments: 0

The automotive industry is deep in the throes of a massive shift to software-defined vehicle architectures, a multi-year effort that will change the way automotive chips are designed, where they are used, and how they are sourced. Creating a new vehicle architecture is no small feat. OEMs need to figure out who to partner with and which aspects of their current architecture to include. This ... » read more

Blog Review: Feb. 5
By Jesse Allen - 05 Feb, 2025 - Comments: 0

Cadence's Rajneesh Chauhan explores the extended metadata feature in CXL 3.1, which helps systems manage memory and devices more effectively by sending extra information along with memory transactions to provide more context about what's happening during these transactions. Siemens' Bianca Ward recommends semiconductor companies combat rising production costs by leaning into digitalization a... » read more

Blog Review: Jan. 29
By Jesse Allen - 29 Jan, 2025 - Comments: 0

Cadence's Reela Samuel looks beyond silicon to new semiconductor materials under development and the particular applications for gallium nitride, silicon carbide, indium phosphide, glass, and diamond. Siemens' Kyle Fraunfelter and Melville Bryant find that lean approaches alone cannot address the increasingly complex sustainability challenges of semiconductor manufacturing and call for the e... » read more

Chip Industry Week In Review
By The SE Staff - 24 Jan, 2025 - Comments: 0

The new Trump administration was quick to put a different stamp on the tech world: President Trump rescinded a long list of Biden’s executive orders, including those aimed at AI safety and the mandate for 50% EVs by 2030. Roughly 1.3 million EVs were sold in the U.S. in 2024, up 7.3% from 2023. The new administration announced $500 billion ($100 billion initially) in private sector in... » read more

Blog Review: Jan. 22
By Jesse Allen - 22 Jan, 2025 - Comments: 0

Cadence's David Shin provides an overview of the eUSB2V2 specification, which scales up to 4.8Gbps of data rate and provides the flexibility to configure either asymmetrical or symmetrical links depending on the intended application. Siemens EDA's Spencer Acain highlights the key role of AI in semiconductor testing, including the addition of analytical AI in DFT tools and how applying machin... » read more

The When, Why, And How Of Waiting And Backoff In Multi-Threaded Applications On Arm
By Ola Liljedahl - 16 Jan, 2025 - Comments: 0

With multithreaded applications, there are situations where it is unavoidable or desirable to wait for other threads. Implementing such wait instruction sequences correctly is important for both multithreaded scalability and power efficiency. Scalability is measured both in terms of aggregated throughput and fairness. Fairness is when all contending threads get an equal share of the contended ... » read more

What’s The Best Way To Sell An Inference Engine?
By Bryon Moyer - 16 Jan, 2025 - Comments: 0

The burgeoning AI market has seen innumerable startups funded on the strength of their ideas about building faster, lower-power, and/or lower-cost AI inference engines. Part of the go-to-market dynamic has involved deciding whether to offer a chip or IP — with some newcomers pivoting between chip and IP implementations of their ideas. The fact that some companies choose to sell chips while... » read more

Blog Review: Jan. 15
By Jesse Allen - 15 Jan, 2025 - Comments: 0

Siemens EDA's Stephen V. Chavez argues that the placement of decoupling capacitors on a PCB can make or break a design's power delivery system and provides some best practices and design considerations, such as ensuring even distribution on a board rather than crowding them around chips. Synopsys' Stelios Diamantidis predicts that in 2025, AI agents will begin collaborating with other AI age... » read more

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