Blog Review: Mar. 27

By Jesse Allen - 27 Mar, 2024 - Comments: 0

Cadence's Steve Brown suggests that multi-die technologies will be a key part of the path toward a faster, more efficient chip ecosystem that can support the compressed development cycles now emerging in the automotive industry. Synopsys' John Swanson, Madhumita Sanyal, and Priyank Shukla point to the role of simulation in ensuring seamless operation in the Ethernet ecosystem though rigorous... » read more

Early STEM Education Key To Growing Future Chip Workforce

By Liz Allan - 25 Mar, 2024 - Comments: 4

A key factor in building a domestic workforce for the chip industry is attracting kids to science, technology, engineering, and math (STEM) subjects at a younger age. That way they are more likely to follow through and attain the skills and degrees needed to enter the semiconductor job market. Industry and government are partnering with schools and community organizations to address the chal... » read more

Chip Industry Week In Review

By The SE Staff - 22 Mar, 2024 - Comments: 0

By Adam Kovac, Gregory Haley, and Liz Allan. The U.S. government released a 61-page report, titled "National Strategy on Microelectronics Research,” by the Subcommittee On Microelectronics Leadership. It provides a framework for government, industry, academia, and international allies to address four major goals. Synopsys acquired Intrinsic ID, which develops physical unclonable func... » read more

Blog Review: March 20

By Jesse Allen - 20 Mar, 2024 - Comments: 0

Synopsys' Kiran Vittal delves into AI chips, including the expansion of chip design beyond traditional semiconductor companies, adoption of RISC-V, and the use of formal equivalence checking to verify complex AI datapaths. Siemens' Patrick McGoff points to a survey that suggests projects deploying design for manufacturing within a PCB design flow are more likely to be completed on-time, on-q... » read more

Optimizing Energy At The System Level

By Brian Bailey - 18 Mar, 2024 - Comments: 0

Power is a ubiquitous concern, and it is impossible to optimize a system's energy consumption without considering the system as a whole. Tremendous strides have been made in the optimization of a hardware implementation, but that is no longer enough. The complete system must be optimized. There are far reaching implications to this, some of which are driving the path toward domain-specific c... » read more

Chip Industry Week In Review

By The SE Staff - 15 Mar, 2024 - Comments: 0

By Adam Kovac, Karen Heyman, and Liz Allan. Europe's semiconductor footprint is growing in areas that previously had little association with chips. Silicon Box plans to build a panel-level foundry in northern Italy, funded in part by the Italian government. The deal is worth around €3.2 billion ($3.6B). In addition, imec will establish a specialized 300mm chip technology pilot line in M... » read more

The Rising Price Of Power In Chips

By Ed Sperling - 14 Mar, 2024 - Comments: 0

Power is everything when it comes to processing and storing data, and much of it isn't good. Power-related issues, particularly heat, dominate chip and system designs today, and those issues are widening and multiplying. Transistor density has reached a point where these tiny digital switches are generating more heat than can be removed through traditional means. That may sound manageable e... » read more

Easing Automotive Software Migration

By Prakash Mohapatra - 14 Mar, 2024 - Comments: 0

The automotive industry is on the cusp of seismic change. Multiple trends are occurring simultaneously that are impacting the entire supply chain of the industry. Software-defined vehicles (SDVs), autonomy and electrification are motivating automotive OEMs to holistically rethink the vehicle’s software and hardware development cycles. To better manage multiple compute elements and increasi... » read more

Blog Review: Mar. 13

By Jesse Allen - 13 Mar, 2024 - Comments: 0

Cadence's Geeta Arora explains the Address Translation Service in PCIe 6.0, which allows an I/O device to perform its own virtual to physical address translations without relying on the host's CPU to reduce latency and improve overall system performance. Synopsys' John Swanson, Jon Ames, Priyank Shukla, and Varun Agrawal highlight the upcoming 1.6T iteration of the Ethernet standard and the ... » read more

Workload Trace Generation

By Arm - 13 Mar, 2024 - Comments: 0

The intended audience for this document is a performance engineer preparing traces for performance prediction on new Arm hardware. It is expected that the reader understands the basic concepts of performance engineering such as: • Workload characterization • Identifying key aspects of a workload • Understanding how Performance Monitor Unit (PMU) events correlate to a workload Click her... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: ARM

Blog Review: Mar. 27

Early STEM Education Key To Growing Future Chip Workforce

Chip Industry Week In Review

Blog Review: March 20

Optimizing Energy At The System Level

Chip Industry Week In Review

The Rising Price Of Power In Chips

Easing Automotive Software Migration

Blog Review: Mar. 13

Workload Trace Generation