tag: ARM

Blog Review: Apr. 30
By Jesse Allen - 30 Apr, 2025 - Comments: 0

Cadence’s Sree Parvathy points out how electrothermal analysis can help designers understand how temperature changes affect device behavior, such as mobility, threshold voltage, and saturation to mitigate potential failures due to thermal overstress. In a podcast, Siemens’ Conor Peick, Dale Tutt, and Mike Ellow chat about the transition towards software-defined products and why companies... » read more

Security Power Requirements Are Growing
By Adam Kovac - 28 Apr, 2025 - Comments: 0

Determining how much power to budget for security in a chip design is a complex calculation. It starts with a risk assessment of the cost of a breach and the number of possible attack vectors, and whether security is active or passive. Different forms of root of trust and cryptography have different power costs. Different systems could require tradeoffs between performance and security, whic... » read more

New Ways To Improve EDA Productivity
By Ann Mutschler - 24 Apr, 2025 - Comments: 0

EDA vendors are taking aim at new ways to improve the productivity of design and verification engineers, who are struggling to keep pace with exponential increases in chip complexity in tight time-to-market windows and with constrained engineering talent pipelines. In the past, progress often was as straightforward as improving algorithms or parallelizing computations in a linear flow. But w... » read more

Chip Industry Week In Review
By The SE Staff - 18 Apr, 2025 - Comments: 0

[Podcast version is here.] TSMC said it will produce 30% of its leading-edge chips in Arizona when all six of its fabs are operational, a total investment of $165 billion, Axios reported. In its latest SEC filing, the foundry said it continues to add capacity in Taiwan, Arizona, Japan, and Germany. The Trump administration launched a Section 232 investigation into semiconductors and relat... » read more

Blog Review: Apr. 16
By Jesse Allen - 16 Apr, 2025 - Comments: 0

Siemens’ Tova Levy finds that heterogeneous integration necessitates a shift to a system-level technology co-optimization approach where power, performance, area, cost, and reliability are considered across various components, including silicon, package, interposer, and PCB. Synopsys’ Greg Sorber listens in as Arm’s Rene Haas and Synopsys’ Sassine Ghazi discuss the opportunity for AI... » read more

Are You Ready For AI?
By Brian Fuller - 10 Apr, 2025 - Comments: 0

The semiconductor industry sits at the heart of the artificial intelligence revolution, providing the essential computational foundation that powers AI's rapid evolution. However, new research suggests that while AI adoption is accelerating globally, strategic implementation remains a significant challenge across industries. According to the recently released Arm AI Readiness Index Report, 8... » read more

Chiplet Tradeoffs And Limitations
By Ann Mutschler - 10 Apr, 2025 - Comments: 0

The semiconductor industry is buzzing with the benefits of chiplets, including faster time to market, better performance, and lower power, but finding the correct balance between customization and standardization is proving to be more difficult than initially thought. For a commercial chiplet marketplace to really take off, it requires a much deeper understanding of how chiplets behave indiv... » read more

3D-IC Ecosystem Starts To Take Form
By Brian Bailey - 10 Apr, 2025 - Comments: 0

The adoption of chiplets is inevitable, but exactly when a mass migration toward this design approach will begin is yet to be determined. Nevertheless, some of the biggest technological and business-related barriers are being addressed. And while a chiplet-based design remains beyond the economic reach of many companies today, that is starting to change. Early signs of an emerging ecosystem ... » read more

Arm AI Readiness Index
By Arm - 09 Apr, 2025 - Comments: 0

The Arm AI Readiness Index report is a comprehensive analysis of global AI readiness and implementation for enterprises worldwide. Drawing on survey data from business leaders across eight countries, the report offers a range of insights exploring the global opportunities and challenges around AI, including: Business adoption Technology requirement The policy and regulatory landscape... » read more

Blog Review: Apr. 2
By Jesse Allen - 02 Apr, 2025 - Comments: 0

Synopsys’ Meenakshy Ramachandran explores how DisplayPort Automotive Extensions help meet functional safety and security standards for the increasingly higher-resolution and more immersive in-vehicle displays in connected, autonomous, shared, and electric vehicles. Siemens’ Gabriella Leone and Michael Munsey discuss the need for a collaborative semiconductor business platform and how to ... » read more

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