Manufacturing Bits: Sept. 9

By Mark LaPedus - 09 Sep, 2020 - Comments: 0

Fusion energy The U.S. Department of Energy (DOE) has announced $29 million in funding for several projects to develop fusion energy technology. The projects will focus on the components, materials and technologies to develop a long-awaited but elusive net-energy-gain “fusion core.” For years, companies, governments and universities have been working on fusion power technology. Fu... » read more

Manufacturing Bits: Sept. 19

By Mark LaPedus - 19 Sep, 2017 - Comments: 1

Ion implant lithography At a recent conference, the University of California at Berkeley presented more details about its efforts to develop a multiple patterning method using tilted ion implantation (TII) technology. TII is somewhat similar today’s self-aligned double patterning (SADP) processes in logic and memory. SADP and the follow-on technology, self-aligned quadruple (SAQP), enable... » read more

Manufacturing Bits: March 29

By Mark LaPedus - 29 Mar, 2016 - Comments: 0

Brain-inspired computing Lawrence Livermore National Laboratory (LLNL) has purchased a brain-inspired supercomputing platform for deep learning developed by IBM Research. Based on a neurosynaptic computer chip called IBM TrueNorth, the scalable platform will process the equivalent of 16 million neurons and 4 billion synapses. It will consume the energy equivalent of a tablet computer. ... » read more

Still Searching For Rare Earths

By Mark LaPedus - 20 Aug, 2015 - Comments: 1

There is both good and bad news for buyers of rare earths. The good news: It’s a buyers’ market. Prices for rare earths remain depressed amid a glut in the marketplace. The bad news: The supplier base is shaky. China still accounts for 85% of the world’s total production of rare earths, but most Chinese suppliers are operating at a loss. And two of the main non-Chinese suppliers, M... » read more

5 Technologies To Watch

By Mark LaPedus - 23 Jul, 2015 - Comments: 0

The industry is developing a dizzying array of new technologies. In fact, there are more new and innovative technologies than ever before. And the list is countless. At least from my vantage point, I have come up with my own list of the top five technologies to watch in 2015 and beyond. They are listed in alphabetical order. (See below). Obviously, there are more than just five technologi... » read more

Manufacturing Bits: April 7

By Mark LaPedus - 07 Apr, 2015 - Comments: 0

Liquid metal for Terminator robots The Chinese Academy of Sciences and Tsinghua University have devised a robot-like, self-fueled liquid metal mollusk. The liquid metal alloy within the system can move by itself and change form like the shape-shifting T-1000 robot in the movie Terminator 2: Judgment Day. The system consists of a liquid metal motor. The liquid metal is a mix of gallium, i... » read more

Avogy: Vertical GaN Power Devices

By Mark LaPedus - 02 Feb, 2015 - Comments: 0

Gallium nitride (GaN), a binary III-V bandgap material, has been used to make LEDs for the last several years. GaN has also been touted as the next big thing in power electronics and RF. To some degree, GaN has made inroads in RF, especially in high-end defense and aerospace applications. But the technology is having mixed success in power electronics. Today’s GaN-on-silicon devices are l... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer