Changes In Auto Architectures

By Ed Sperling - 04 Aug, 2021 - Comments: 0

Automotive architectures are changing from a driver-centric model to one where technology supplements and in some cases replaces the driver. Hans Adlkofer, senior vice president and head of the Automotive Systems Group at Infineon, looks at the different levels of automation in a vehicle, what’s involved in the shift from domain to zonal architectures, why a mix of processors will be required... » read more

FPGAs Drive Deeper Into Cars

By Ann Mutschler - 09 Jul, 2018 - Comments: 3

FPGAs are reaching deeper and wider inside of automobiles, playing an increasingly important role across more systems within a vehicle as the electronic content continues to grow. The role of FPGAs in automotive cameras and sensors is already well established. But they also are winning sockets inside of a raft of new technologies, ranging from the AI systems that will become the central logi... » read more

ISO 26262 Statistics

By Ed Sperling - 02 Jul, 2018 - Comments: 0

Jorg Gosse, functional safety product manager at OneSpin Solutions, talks about the statistics behind the standards, what is considered good enough, and how those numbers vary across different standards. https://youtu.be/cNTFN3kQ-OM » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: ASIL C

Changes In Auto Architectures

FPGAs Drive Deeper Into Cars

ISO 26262 Statistics