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Fan-Out Packaging Options Grow


Chipmakers, OSATs and R&D organizations are developing the next wave of fan-out packages for a range of applications, but sorting out the new options and finding the right solution is proving to be a challenge. Fan-out is a way to assemble one or more dies in an advanced package, enabling chips with better performance and more I/Os for applications like computing, IoT, networking and sma... » read more

System Bits: Oct. 15


When self-driving cars collide As self-driving car technology develops and evolves, it is inevitable that there will be collisions while the tech matures. “What can we do in order to minimize the consequences?” asks Amir Khajepour, a professor of mechanical and mechatronics engineering at the University of Waterloo. “That is our focus.” The first rule for the autonomous vehicle (... » read more