tag: A*Star

Manufacturing Bits: Aug. 2
By Mark LaPedus - 02 Aug, 2016 - Comments: 0

CMP replacement? For years, chipmakers have used chemical-mechanical-polishing (CMP) tools to smooth or polish the surface of a wafer. CMP works, but the technology is time-consuming and expensive. CMP can also leave unwanted residual patterns and defects near the surface. In response, Russia’s National Research Nuclear University MEPhI (Moscow Engineering Physics Institute) has help... » read more

Manufacturing Bits: July 19
By Mark LaPedus - 19 Jul, 2016 - Comments: 0

Detecting anapoles A*STAR has detected invisible particles. Researchers from the Singaporean R&D organization have observed a new optical effect in nanoscale disks of silicon, which are patterns of radiation that do not scatter light. One example of a non-radiating source is called an anapole. An anapole, according to A*Star, is a distribution of charges and currents. They do not radiate wi... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 01 Jul, 2016 - Comments: 0

Fab tools Applied Materials has officially rolled out the Producer Selectra system, a selective etch tool. The system falls under the loosely defined category called atomic layer etch (ALE). Applied’s technology addresses a number of challenges. Today’s advanced chips have complex structures. They may also have deep and narrow trenches. One of the challenges is the inability of wet ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 10 Jun, 2016 - Comments: 0

MEMS manufacturing A*STAR’s Institute of Microelectronics (IME) in Singapore has launched its third consortium to develop MEMS technologies. This would allow MEMS sensor devices to achieve better performance, higher power efficiency and a smaller form factor. The MEMS Consortium III consists of the following companies: Applied Materials, Coventor, Delta Electronics, GlobalFoundries, InvenS... » read more

Fan-Out Packaging Gains Steam
By Mark LaPedus - 23 Nov, 2015 - Comments: 1

Fan-outs are creating a buzz and gaining steam in the market at a pace far beyond what anyone would have expected even at the start of the year. The approach, which has been around for several years, is a wafer-level packaging process that enables ultra-thin, high-density packages. So why the buzz? Apple is apparently moving to [getkc id="202" kc_name="fan-out"] packaging, according to an... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 23 Oct, 2015 - Comments: 0

In a major and surprising move in the fab tool business, Lam Research has entered into a definitive agreement to acquire KLA-Tencor for about $10.6 billion in cash and stock. "Lam Research and KLA-Tencor have been working to tie together process and process control in an effort to expand process windows and better enable complex production steps, like multi-patterning. This acquisition form... » read more

Manufacturing Bits: Oct. 20
By Mark LaPedus - 20 Oct, 2015 - Comments: 0

Singapore opens R&D center The Agency for Science, Technology and Research (A*STAR) has officially opened its new R&D center in Singapore. The center, dubbed Fusionopolis Two, is a $450 million facility, according to Singapore’s A*STAR. It will provide the industry with co-location opportunities for R&D. Anchored at Fusionopolis Two are the following A*STAR research institutes: th... » read more

Manufacturing Bits: August 4
By Mark LaPedus - 04 Aug, 2015 - Comments: 0

Diamond metrology The U.S. Department of Energy’s Ames Laboratory is building a new instrument called an optical magnetometer. The system will help researchers understand the properties of new magnetic nanomaterials. The system, dubbed the NV-magnetoscope, makes use of the properties of nitrogen-vacancy (NV) centers in diamonds. According to researchers, diamonds have a flaw, or imperfect... » read more

Semiconductor R&D Crisis?
By Mark LaPedus - 11 Jun, 2015 - Comments: 3

Research and development is a sometimes forgotten but critical element in the semiconductor industry. The delicate R&D ecosystem enables many of the key breakthroughs in the business. But there could be a troubling trend, if not a crisis, brewing on two fronts in the R&D arena. On one front, R&D costs for semiconductor technologies are escalating at each node. Higher R&D costs are not only ... » read more

Manufacturing Bits: May 19
By Mark LaPedus - 19 May, 2015 - Comments: 0

Self-steering bullets DARPA has completed the development of a self-steering bullet that increases the hit rate for long-distance shots. The effort, dubbed the Extreme Accuracy Tasked Ordnance (EXACTO) program, is aimed for military snipers. The technology combines a maneuverable bullet and a real-time guidance system to track and deliver the projectile to the target, according to DARPA. It... » read more

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