The Week In Review: Manufacturing

By Mark LaPedus - 10 Jun, 2016 - Comments: 0

MEMS manufacturing A*STAR’s Institute of Microelectronics (IME) in Singapore has launched its third consortium to develop MEMS technologies. This would allow MEMS sensor devices to achieve better performance, higher power efficiency and a smaller form factor. The MEMS Consortium III consists of the following companies: Applied Materials, Coventor, Delta Electronics, GlobalFoundries, InvenS... » read more

Fan-Out Packaging Gains Steam

By Mark LaPedus - 23 Nov, 2015 - Comments: 1

Fan-outs are creating a buzz and gaining steam in the market at a pace far beyond what anyone would have expected even at the start of the year. The approach, which has been around for several years, is a wafer-level packaging process that enables ultra-thin, high-density packages. So why the buzz? Apple is apparently moving to [getkc id="202" kc_name="fan-out"] packaging, according to an... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 23 Oct, 2015 - Comments: 0

In a major and surprising move in the fab tool business, Lam Research has entered into a definitive agreement to acquire KLA-Tencor for about $10.6 billion in cash and stock. "Lam Research and KLA-Tencor have been working to tie together process and process control in an effort to expand process windows and better enable complex production steps, like multi-patterning. This acquisition form... » read more

Manufacturing Bits: Oct. 20

By Mark LaPedus - 20 Oct, 2015 - Comments: 0

Singapore opens R&D center The Agency for Science, Technology and Research (A*STAR) has officially opened its new R&D center in Singapore. The center, dubbed Fusionopolis Two, is a $450 million facility, according to Singapore’s A*STAR. It will provide the industry with co-location opportunities for R&D. Anchored at Fusionopolis Two are the following A*STAR research institutes: th... » read more

Manufacturing Bits: August 4

By Mark LaPedus - 04 Aug, 2015 - Comments: 0

Diamond metrology The U.S. Department of Energy’s Ames Laboratory is building a new instrument called an optical magnetometer. The system will help researchers understand the properties of new magnetic nanomaterials. The system, dubbed the NV-magnetoscope, makes use of the properties of nitrogen-vacancy (NV) centers in diamonds. According to researchers, diamonds have a flaw, or imperfect... » read more

Semiconductor R&D Crisis?

By Mark LaPedus - 11 Jun, 2015 - Comments: 3

Research and development is a sometimes forgotten but critical element in the semiconductor industry. The delicate R&D ecosystem enables many of the key breakthroughs in the business. But there could be a troubling trend, if not a crisis, brewing on two fronts in the R&D arena. On one front, R&D costs for semiconductor technologies are escalating at each node. Higher R&D costs are not only ... » read more

Manufacturing Bits: May 19

By Mark LaPedus - 19 May, 2015 - Comments: 0

Self-steering bullets DARPA has completed the development of a self-steering bullet that increases the hit rate for long-distance shots. The effort, dubbed the Extreme Accuracy Tasked Ordnance (EXACTO) program, is aimed for military snipers. The technology combines a maneuverable bullet and a real-time guidance system to track and deliver the projectile to the target, according to DARPA. It... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 24 Apr, 2015 - Comments: 0

For years, Altera’s sole foundry was TSMC. Then, not long ago, Altera selected Intel as its foundry partner for 14nm. TSMC still handles 20nm and above work for Altera. This quarter, Altera was supposed to select a foundry partner for 10nm. This week, Altera posted lackluster results in the quarter. Altera did not elaborate on its 10nm plans, nor did it discuss the Intel rumors. "Altera did n... » read more

Manufacturing Bits: April 21

By Mark LaPedus - 21 Apr, 2015 - Comments: 0

Fan-out packaging consortium A*STAR’s Institute of Microelectronics (IME) and others have formed a high-density fan-out wafer level packaging (FOWLP) consortium in Singapore. Others in the group include Amkor, Nanium, STATS ChipPAC, NXP, GlobalFoundries, Kulicke & Soffa, Applied Materials, Dipsol Chemicals, JSR, KLA-Tencor, Kingyoup Optronics, Orbotech and Tokyo Ohka Kogyo (TOK). T... » read more

Manufacturing Bits: Nov. 4

By Mark LaPedus - 04 Nov, 2014 - Comments: 0

World’s fastest IC amplifier Northrop Grumman has set a record for the world’s fastest integrated circuit amplifier. The record has been recognized by officials from Guinness World Records. The amplifier uses 10 transistor stages to reach an operating speed of one terahertz, or one trillion cycles per second. This surpassed the company's own record of 850 billion cycles per second set i... » read more

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tag: A*Star

The Week In Review: Manufacturing

Fan-Out Packaging Gains Steam

The Week In Review: Manufacturing

Manufacturing Bits: Oct. 20

Manufacturing Bits: August 4

Semiconductor R&D Crisis?

Manufacturing Bits: May 19

The Week In Review: Manufacturing

Manufacturing Bits: April 21

Manufacturing Bits: Nov. 4