Manufacturing Bits: Feb. 18

By Mark LaPedus - 18 Feb, 2020 - Comments: 0

Molecular layer etch The U.S. Department of Energy’s Argonne National Laboratory has made new advances in the field of molecular layer etching or etch (MLE). MLE is related to atomic layer etch (ALE). Used in the semiconductor industry, ALE selectively removes targeted materials at the atomic scale without damaging other parts of the structure. ALE is related to atomic layer deposition... » read more

Manufacturing Bits: March 26

By Mark LaPedus - 26 Mar, 2019 - Comments: 0

ALD materials database Atomic Limits, a blog site that addresses atomic-level processing technologies, has developed an online database listing all atomic layer deposition (ALD) materials and processes. The database could be useful for ALD processes in semiconductors and other fields. ALD is a deposition technique that deposits materials one layer at a time. In ALD systems, wafers are place... » read more

Manufacturing Bits: Aug. 15

By Mark LaPedus - 15 Aug, 2017 - Comments: 0

Self-collapse lithography The University of California at Los Angeles (UCLA) has developed a technology called self-collapse lithography. The technology, reported in the journal Nano Letters, resembles the combination of nanoimprint, selective removal and a chemical lift-off process. More specifically, though, the technology provides insights into patterning using a chemical lift-off lith... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Atomic Limits

Manufacturing Bits: Feb. 18

Manufacturing Bits: March 26

Manufacturing Bits: Aug. 15