Security Concerns Weigh Down Open-Source EDA

By Adam Kovac - 10 Oct, 2024 - Comments: 0

Open-source EDA tools are free, readily available, and growing in numbers, but many chipmakers are wary of using them due to security concerns. On the plus side, proponents say these tools can help attract fresh new talent to chip design. Yet despite their spread online — GitHub alone has more than 140 EDA-specific repositories — using visible source code can provide new avenues of attac... » read more

SolarWinds Attack Is A Cautionary Tale For Hardware And Its Supply Chain

By John Hallman - 04 Feb, 2021 - Comments: 0

The recent SolarWinds hacking incident that left many Fortune-500 companies and US government networks exposed is an interesting cautionary tale for unchecked software and hardware supply chain security vulnerabilities. The highly sophisticated software supply chain attack occurred in the SolarWinds Orion IT monitoring system. This system, used by over 33,000 companies, monitors performance acr... » read more

Security Breaches And The Defensive Mindset

By Paul McLellan - 07 Jan, 2021 - Comments: 0

Over the Christmas break, the biggest security breach ever came to light. It is assumed to be instigated by a foreign entity. The breach is known mostly as SolarWinds. SolarWinds produces network management software called Orion that is used by...well, almost everyone. The attackers inserted a backdoor into an Orion software update. You know how the operating system on your PC or Mac gets autom... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: backdoors

Security Concerns Weigh Down Open-Source EDA

SolarWinds Attack Is A Cautionary Tale For Hardware And Its Supply Chain

Security Breaches And The Defensive Mindset