Automotive IC Design Drives Simulation Innovation

By Ahmed Eisawy - 01 Sep, 2016 - Comments: 0

By Roberto Stella, STMicroelectronics and Ahmed Eisawy, Mentor Graphics STMicroelectronics invented the Bipolar, CMOS, DMOS (BCD) technology for the intelligent power applications demanded by automotive ICs. This technology is widely-adopted by the automotive IC industry. But, designing automotive ICs is very challenging. It requires innovative techniques to ensure that the ICs can stand u... » read more

Ray Zinn Reflects On 37 Years As CEO Of Micrel

By Brian Bailey - 26 May, 2016 - Comments: 0

Believed to be the longest serving CEO of any company to have existed in Silicon Valley, Ray Zinn does more in retirement than many people would accomplish as full time employees. While his name may not be at the top of most influential people in the valley, the industry may not be the same today had it not been for his contributions. Semiconductor Engineering spoke with him about his past, the... » read more

Challenges At Advanced Nodes

By Ed Sperling - 23 Jul, 2015 - Comments: 1

Semiconductor Engineering sat down to discuss finFETs, 22nm FD-SOI and how the how the market will segment over the next few years with Marie Semeria, CEO of [getentity id="22192" e_name="Leti"]; Patrick Soheili, vice president of product management and corporate development at [getentity id="22242" e_name="eSilicon"]; Paul Boudre, CEO of Soitec; and Subramani Kengeri, vice president of global ... » read more

Manufacturing Bits: Jan. 28

By Mark LaPedus - 28 Jan, 2014 - Comments: 0

Spintronics gains traction The field of spintronics is gaining interest. The technology could enable a new class of spin-based devices, which combine the switching speeds of logic and the non-volatility of memory. Controlling the magnetism by means of electric fields is the key for future devices, but the ability to switch ferromagnetism technology at room temperature is challenging. Helmho... » read more

Foundries Eye 300mm Analog Fabs

By Mark LaPedus - 18 Jul, 2013 - Comments: 0

By Mark LaPedus In 2009, Texas Instruments changed the semiconductor landscape when it opened the industry’s first 300mm fab for analog chips. Until then, analog chip production was conducted in fabs at 200mm wafer sizes and below. With a 300mm fab, TI potentially could gain a die-size and cost advantage over its analog rivals. On paper, a 300mm wafer provides 2.5 times more chips than a... » read more

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tag: BCD

Automotive IC Design Drives Simulation Innovation

Ray Zinn Reflects On 37 Years As CEO Of Micrel

Challenges At Advanced Nodes

Manufacturing Bits: Jan. 28

Foundries Eye 300mm Analog Fabs