tag: Brewer Science

Transistors Reach Tipping Point At 3nm
By Mark LaPedus - 23 Feb, 2022 - Comments: 1

The semiconductor industry is making its first major change in a new transistor type in more than a decade, moving toward a next-generation structure called gate-all-around (GAA) FETs. Although GAA transistors have yet to ship, many industry experts are wondering how long this technology will deliver — and what new architecture will take over from there. Barring major delays, today’s GAA... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 04 Feb, 2022 - Comments: 2

Government policy The Government of Quebec and IBM have announced a new partnership to establish Quebec as a technology hub in the development of quantum computing, artificial intelligence, semiconductors and high-performance computing. The two entities have formed the Quebec-IBM Discovery Accelerator. The new technology hub aims to focus on developing new projects, collaborations, and skills-... » read more

Next-Gen 3D Chip/Packaging Race Begins
By Mark LaPedus - 31 Jan, 2022 - Comments: 5

The first wave of chips is hitting the market using a technology called hybrid bonding, setting the stage for a new and competitive era of 3D-based chip products and advanced packages. AMD is the first vendor to unveil chips using copper hybrid bonding, an advanced die-stacking technology that enables next-generation 3D-like devices and packages. Hybrid bonding stacks and connects chips usin... » read more

Sustainability In Creating Next-Gen Materials
By Jessica Albright - 20 Jan, 2022 - Comments: 0

In recent years, sustainable manufacturing has become increasingly vital in the materials industry with growing concerns about the impact of manufacturing on the environment. Minimizing the intrinsic risks associated with any manufacturing operation while maximizing the quality and opportunities that arise with improved products is and should be the goal of almost every manufacturer today. At... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 07 Jan, 2022 - Comments: 0

Automotive As part of its in-cabin monitoring wares at Consumer Electronics Show (CES) 2022, U.S.-based Gentex demonstrated the Vaporsens gas sensors, a nanofiber chemical sensor technology that monitors cabin air quality and can ID airborne contaminants. One use would be to monitor if outside contaminants get into the cabin, the sensor could trigger the car to turn on the recirculation of air... » read more

Expanding Advanced Packaging Production In The U.S.
By Mark LaPedus - 05 Jan, 2022 - Comments: 0

The United States is taking the first steps toward bringing larger-scale IC packaging production capabilities back to the U.S. as supply chain concerns and trade tensions grow. The U.S. is among the leaders in developing packages, especially new and advanced forms of the technology that promise to shake up the semiconductor landscape. And while the U.S. has several packaging vendors, North A... » read more

Six Examples Of Predictive Maintenance
By Jessica Albright - 16 Dec, 2021 - Comments: 0

One of the many tools that condition monitoring enables us to provide is predictive maintenance. Predictive maintenance allows you to improve business efficiency by minimizing downtime and increasing productivity. This is achieved by strategically monitoring assets and conditions specific to your business, which vary significantly based on your industry. While several companies directly be... » read more

A Novel Multifunctional Single-Layer Adhesive Used For Both Temporary Bonding And Mechanical Debonding in Wafer-Level Packaging Applications
By Brewer Science - 15 Dec, 2021 - Comments: 0

Temporary bonding (TB) and debonding (DB) of wafers have been widely developed and applied over the last decade in various wafer-level packaging technologies, such as package-on-package (PoP), fan-out integration, and 2.5D and 3D integration using through-silicon vias (TSVs). The materials used to achieve TB and DB are extremely critical and the industry's current best practice is the use of tw... » read more

Using Manufacturing Data To Boost Reliability
By Ed Sperling and Ann Mutschler - 07 Dec, 2021 - Comments: 0

As chipmakers turn to increasingly customized and complex heterogeneous designs to boost performance per watt, they also are demanding lower defectivity and higher yields to help offset the rising design and manufacturing costs. Solving those issues is a mammoth multi-vendor effort. There can be hundreds of process steps in fabs and packaging houses. And as feature sizes continue to shrink, ... » read more

End In Sight For Chip Shortages?
By Mark LaPedus - 18 Nov, 2021 - Comments: 2

The current wave of semiconductor and IC packaging shortages is expected to extend well into 2022, but there are also signs that supply may finally catch up with demand. The same is true for manufacturing capacity, materials and equipment in both the semiconductor and packaging sectors. Nonetheless, after a period of shortages in all segments, the current school of thought is that chip suppl... » read more

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