tag: Bunch Of Wires

UMI: Extending Chiplet Interconnect Standards To Deal With The Memory Wall
By Ramin Farjadrad - 14 Oct, 2024 - Comments: 0

With the Open Compute Project (OCP) Summit upon us, it’s an appropriate time to talk about chiplet interconnect (in fact the 2024 OCP Summit has a whole day dedicated to the multi-die topic, on October 17). Of particular interest is the Bunch of Wires (BoW) interconnect specification that continues to evolve. At OCP there will be an update and working group looking at version 2.1 of BoW. (... » read more

Barriers To Chiplet Sockets
By Brian Bailey - 30 Sep, 2024 - Comments: 0

Experts At The Table: Demand for chiplets is growing, but debate continues about whether standards and general-purpose chiplets will kick-start the commercialization boom, or whether success will come through customization of those chiplets. Semiconductor Engineeering sat down to discuss these and other related issues with Elad Alon, CEO of Blue Cheetah; Mark Kuemerle, vice president of technol... » read more

Defining The Chiplet Socket
By Brian Bailey - 29 Aug, 2024 - Comments: 0

Experts At The Table: The semiconductor industry has been buzzing with the possibilities surrounding chiplets, but so far this packaging technology has been confined to large semiconductor companies that are vertically integrated. The industry has been attempting to open this up to a broader group of people. To work out what this means for chiplets, and what standardization will be required, Se... » read more

UCIe Goes Back To The Drawing Board
By Gregory Haley - 22 Feb, 2024 - Comments: 0

The integration of multiple dies within a single package increasingly is viewed as the next evolution for extending Moore’s Law, but it also presents myriad challenges — particularly in achieving a universally accepted standard integrating plug-and-play chiplets from different vendors. “In some respects, people are already doing this,” says Debendra Das Sharma, Intel senior fellow an... » read more

Chiplets: Deep Dive Into Designing, Manufacturing, And Testing
By The SE Staff - 07 Aug, 2023 - Comments: 0

Chiplets are a disruptive technology. They change the way chips are designed, manufactured, tested, packaged, as well as the underlying business relationships and fundamentals. But they also open the door to vast new opportunities for existing chipmakers and startups to create highly customized components and systems for specific use cases and market segments. This LEGO-like approach sounds ... » read more

Auto Industry Relationships Re-Form, But Differently
By Ann Mutschler - 12 Jun, 2023 - Comments: 0

The automotive industry is in the midst of rapid change on many fronts. OEMs are exploring new functions and features to add to their vehicles, including chiplets, electrification, autonomous features, as well as new vehicle architectures that will determine how vehicles are going to be designed from the foundation up. But all of this is dependent on the relationships between all of the ecosyst... » read more

Automotive Relationships Shifting With Chiplets
By Ann Mutschler - 24 May, 2023 - Comments: 0

The automotive industry is in the midst of a tremendous and rapid change on many fronts. OEMs are exploring new functions and features to add to their vehicles, including chiplets, electrification, autonomous features, as well as new vehicle architectures that will determine how vehicles are going to be designed from the foundation up. All of this is dependent on the relationships between all o... » read more

Chiplets: More Standards Needed
By Andy Heinig - 13 Apr, 2023 - Comments: 1

Recent months have seen new advances in chiplet standardization. For example, consortia such as Bunch of Wires (BoW) and Universal Chiplet Interconnect Express (UCIe) have made progress in developing standards for die-to-die (D2D) interfaces in a chiplet’s design. Far from being a new phenomenon in communication, these types of standards are established for all forms of wired and wireless com... » read more

Will AI Take My Job?
By Brian Bailey - 23 Feb, 2023 - Comments: 0

Everyone is talking about ChatGPT these days, and I am sure we will be comparing it with Google's new offering before long. I thought it was time that I gave it a quick spin, and since I am preparing to moderate a webinar about chiplets as I write this, I decided it was a good example of a fairly new field and would be a good test. I started by asking, "What are semiconductor chiplets, what ... » read more

Edge AI And Chiplets
By Andy Heinig - 08 Dec, 2022 - Comments: 0

In the near future, more edge artificial intelligence (AI) solutions will find their way into our lives. This will be especially true in the private sector for applications in the field of voice input and analysis of camera data, which will become well-established. These application areas require powerful AI hardware to be able to process the corresponding continuously accumulating data volumes... » read more

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