tag: Cambridge University

Chip Industry Week In Review
By The SE Staff - 11 Oct, 2024 - Comments: 0

Imec announced a new automotive chiplet consortium to evaluate which different architectures and packaging technologies are best for automotive applications. Initial members includes Arm, ASE, Cadence, Siemens, Synopsys, Bosch, BMW, Tenstorrent, Valeo, and SiliconAuto. Imec also launched star, a global network bringing together automotive and semiconductor innovators to address technological c... » read more

Chip Industry Technical Paper Roundup: Sept. 9
By Linda Christensen - 09 Sep, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=354 /] More ReadingTechnical Paper Library home » read more

New Strategies For Enhancing Transport Properties of Conducting Polymers (Cambridge, et al.)
By Technical Paper Link - 06 Sep, 2024 - Comments: 0

A new technical paper titled "Non-equilibrium transport in polymer mixed ionic–electronic conductors at ultrahigh charge densities" was published by researchers at Cambridge University, Grenoble Alpes University, CNRS, Humboldt-Universität zu Berlin, et al. Abstract "Conducting polymers are mixed ionic–electronic conductors that are emerging candidates for neuromorphic computing, bioel... » read more

Chip Industry Technical Paper Roundup: July 22
By Linda Christensen - 22 Jul, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library. [table id=245 /] More ReadingTechnical Paper Library home » read more

SiC Power Electronics Packaging: Floating Die Structure and Liquid Metal Fluidic Connection (Cambridge U. )
By Technical Paper Link - 17 Jul, 2024 - Comments: 0

A new technical paper titled "Liquid Metal Fluidic Connection and Floating Die Structure for Ultralow Thermomechanical Stress of SiC Power Electronics Packaging" was published by researchers at Cambridge University. Abstract "Coefficients of thermal expansion (CTE) of various materials in packaging structure layers vary largely, causing significant thermomechanical stress in power electroni... » read more

Research Bits: December 11
By Jesse Allen - 11 Dec, 2023 - Comments: 0

Diamond device with high breakdown voltage Researchers from the University of Illinois at Urbana-Champaign developed diamond p-type lateral Schottky barrier diodes they say have the highest breakdown voltage and lowest leakage current compared to previous diamond devices. The diamond device can sustain high voltage, approximately 5 kV, although the voltage was limited by setup of measurement a... » read more

New Concepts Required For Security Verification
By Brian Bailey - 28 Aug, 2023 - Comments: 0

Verification for security requires new practices in both the development and verification flows, but tools and methodologies to enable this are rudimentary today. Flows are becoming more complex, especially when they span multiple development groups. Security is special in that it is pervasive throughout the development process, requiring both positive and negative verification. Positive ver... » read more

MicroLEDs Move Toward Commercialization
By Laura Peters - 29 Aug, 2022 - Comments: 1

The market for MicroLED displays is heating up, fueled by a raft of innovations in design and manufacturing that can increase yield and reduce prices, making them competitive with LCD and OLED devices. MicroLED displays are brighter and higher contrast than their predecessors, and they are more efficient. Functional prototypes have been developed for watches, AR glasses, TVs, signage, and au... » read more

Who Does Processor Validation?
By Brian Bailey - 27 Jun, 2022 - Comments: 1

Defining what a processor is, and what it is supposed to do, is not always as easy as it sounds. In fact, companies are struggling with the implications of hundreds of heterogenous processing elements crammed into a single chip or package. Companies have extensive verification methodologies, but not for validation. Verification is a process of ensuring that an implementation matches a specif... » read more

High-Level Synthesis For RISC-V
By Brian Bailey - 28 Oct, 2021 - Comments: 2

High-quality RISC-V implementations are becoming more numerous, but it is the extensibility of the architecture that is driving a lot of design activity. The challenge is designing and implementing custom processors without having to re-implement them every time at the register transfer level (RTL). There are two types of high-level synthesis (HLS) that need to be considered. The first is ge... » read more

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