Chip Industry Week In Review

By The SE Staff - 12 Apr, 2024 - Comments: 0

Applied Materials may scale back or cancel its $4 billion new Silicon Valley R&D facility in light of the U.S. government's recent announcement to reduce funding for construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the United States, according to the San Francisco Chronicle. TSMC could receive up to $6.6 billion in direct funding... » read more

Chip Industry Technical Paper Roundup: March 26

By Linda Christensen - 26 Mar, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library. [table id=209 /] Find last week's technical paper additions here. » read more

TCAM-SSD: A Framework For In-SSD Associative Search Using NAND Flash Memory

By Technical Paper Link - 15 Mar, 2024 - Comments: 0

A new technical paper titled "TCAM-SSD: A Framework for Search-Based Computing in Solid-State Drives" was published by researchers at University of Illinois Urbana-Champaign, Carnegie Mellon University, Samsung Electronics and Sandia National Laboratories. Abstract "As the amount of data produced in society continues to grow at an exponential rate, modern applications are incurring signific... » read more

Chip Industry Technical Paper Roundup: Mar. 11

By Liz Allan - 11 Mar, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=205 /] More ReadingTechnical Paper Library home » read more

Efficient Streaming Language Models With Attention Sinks (MIT, Meta, CMU, NVIDIA)

By Technical Paper Link - 04 Mar, 2024 - Comments: 0

A technical paper titled “Efficient Streaming Language Models with Attention Sinks” was published by researchers at Massachusetts Institute of Technology (MIT), Meta AI, Carnegie Mellon University (CMU), and NVIDIA. Abstract: "Deploying Large Language Models (LLMs) in streaming applications such as multi-round dialogue, where long interactions are expected, is urgently needed but poses tw... » read more

Latency, Interconnects, And Poker

By Ed Sperling - 20 Feb, 2024 - Comments: 0

Semiconductor Engineering sat down with Larry Pileggi, Coraluppi Head and Tanoto Professor of Electrical and Computer Engineering at Carnegie Mellon University, and the winner of this year's Phil Kaufman Award for Pioneering Contributions. What follows are excerpts of that conversation. SE: When did you first get started working in semiconductors — and particularly, EDA? Pileggi: This w... » read more

Chip Industry Talent Shortage Drives Academic Partnerships

By Liz Allan - 16 Oct, 2023 - Comments: 0

Universities around the world are forming partnerships with semiconductor companies and governments to help fill open and future positions, to keep curricula current and relevant, and to update and expand skills for working engineers. Talent shortages repeatedly have been cited as the number one challenge for the chip industry. Behind those concerns are several key drivers, and many more dom... » read more

Technical Paper Roundup: Sept 11

By Liz Allan - 11 Sep, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=136 /] (more…) » read more

An Eco-Friendly Conductive Ink For Thin-Film Electronics

By Technical Paper Link - 06 Sep, 2023 - Comments: 0

A technical paper titled “Recyclable Thin-Film Soft Electronics for Smart Packaging and E-Skins” was published by researchers at Carnegie Mellon University and University of Coimbra. Abstract: Despite advances in soft, sticker-like electronics, few efforts have dealt with the challenge of electronic waste. Here, this is addressed by introducing an eco-friendly conductive ink for thin-film... » read more

Week In Review: Auto, Security, Pervasive Computing

By Liz Allan - 04 Aug, 2023 - Comments: 0

Hyundai, Samsung Catalyst Fund, and others invested a combined $100 million in Canada-based Tenstorrent to accelerate the design and development of AI chiplets and machine-learning software and allow the integration of AI into future Hyundai, Kia, and Genesis vehicles, plus other future mobilities such as robotics and advanced air mobility (AAM). The National Highway Traffic Safety Administr... » read more

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