tag: Carnegie Mellon University

Research Bits: Apr. 29
By Jesse Allen - 29 Apr, 2025 - Comments: 0

Microchannels for two-phase cooling Researchers from the University of Tokyo propose cooling chips using microchannels built into the chips themselves. The method utilizes microfluidic channels to create a capillary structure through which coolant flows and a manifold distribution layer that controls the distribution of coolant. The structure enabled two-phase cooling through better managem... » read more

Chip Industry Technical Paper Roundup: Mar. 4
By Linda Christensen - 04 Mar, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=410 /] Find more semiconductor research papers here. » read more

3D Stacked Device Architecture Enabled By BEOL-Compatible Transistors (Stanford et al.)
By Technical Paper Link - 26 Feb, 2025 - Comments: 0

A new technical paper titled "Omni 3D: BEOL-Compatible 3-D Logic With Omnipresent Power, Signal, and Clock" was published by researchers at Stanford University, Intel Corporation and Carnegie Mellon University. Abstract "This article presents Omni 3D—a 3-D-stacked device architecture that is naturally enabled by back-end-of-line (BEOL)-compatible transistors. Omni 3D interleaves metal lay... » read more

Liquid-Infused Nanostructured Composites As A Universal Thermal Interface Solution for Cooling Applications
By Technical Paper Link - 20 Jan, 2025 - Comments: 0

A new technical paper titled "Liquid-infused nanostructured composite as a high-performance thermal interface material for effective cooling" was published by researchers at Carnegie Mellon University, Oregon State University and Arieca. Abstract "Effective heat dissipation remains a grand challenge for energy-dense devices and systems. As heterogeneous integration becomes increasingly inev... » read more

Chip Industry Technical Paper Roundup: Oct. 22
By Linda Christensen - 22 Oct, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=371 /]   More Reading Chip Industry Week In Review AI CPU chiplet platform; Intel-AMD pact; GDDR7 DRAM; AI-RFIC funding; CHIPS Act awards; NoC tiling; thermal modeling on chiplets; $900M nuclear tech and more. Technical Paper Library home » read more

3D Device With BEOL-Compatible Channel And Physical Design for Efficient Double-Side Routing
By Technical Paper Link - 17 Oct, 2024 - Comments: 0

A new technical paper titled "Omni 3D: BEOL-Compatible 3D Logic with Omnipresent Power, Signal, and Clock" was published by researchers at Stanford University, Intel Corporation, and Carnegie Mellon University. Abstract "This paper presents Omni 3D - a 3D-stacked device architecture that is naturally enabled by back-end-of-line (BEOL)-compatible transistors. Omni 3D arbitrarily interleaves ... » read more

Chip Industry Week In Review
By The SE Staff - 27 Sep, 2024 - Comments: 0

Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, according to SEMI. Key drivers are the regionalization of semiconductor fabs and the increasing demand for AI chips in data centers and edge devices, with China, South Korea, and Taiwan leading the way. The Biden-Harris Administration launched the National Semiconductor Technology Center’... » read more

Chip Industry Technical Paper Roundup: Sept. 24
By Linda Christensen - 24 Sep, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=358 /] More ReadingTechnical Paper Library home » read more

Improving The Air-Stability and NBTI Reliability of BEOL CNFETs
By Technical Paper Link - 19 Sep, 2024 - Comments: 0

A new technical paper titled "Overcoming Ambient Drift and Negative-Bias Temperature Instability in Foundry Carbon Nanotube Transistors" was published by researchers at MIT, Stanford University, Carnegie Mellon University and Analog Devices. Abstract: "Back-end-of-line (BEOL) logic integration is emerging as a complementary scaling path to supplement front-end-of-line (FEOL) Silicon. Among ... » read more

Security Technical Paper Roundup: Aug. 27
By Liz Allan - 27 Aug, 2024 - Comments: 0

A number of hardware security-related technical papers were presented at the August 2024 USENIX Security Symposium. The organization provides open access research, and the presentation slides and papers are free to the public. Topics include side-channel attacks and defenses, embedded security, fuzzing, fault injection, logic locking, Rowhammer, and more. Here are some highlights with associate... » read more

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