China’s Electric Car Ambitions

By Mark LaPedus - 20 Sep, 2018 - Comments: 1

China, the world’s largest car market, is also leading the charge in the electric vehicle business. But with little or no fanfare, China also wants to dominate the critical ecosystem for battery-electric vehicles and hybrids. In fact, the nation is already the world’s largest producer of batteries for electric vehicles. And it also controls a sizable part of the supply chain, such as the... » read more

Cobalt Shortages Ahead

By Mark LaPedus - 10 Sep, 2018 - Comments: 0

Rapid growth of electric vehicles is creating an enormous demand for cobalt, causing tight supply, high prices and supply chain issues for this critical material. Cobalt is a ferromagnetic metal and one of the key materials used in lithium-ion batteries for cell phones, notebook PCs, battery-electric cars and hybrids. It also is used in alloys and semiconductors. And while the IC industry co... » read more

Metal Markets In Flux

By Mark LaPedus - 24 Jan, 2018 - Comments: 0

Markets for critical metals are becoming turbulent, creating shortages and widespread supply chain concerns. Critical metals are the raw elements and materials used in the production of aerospace/defense systems, automobiles, batteries, computers and electronic products. Many critical metals also are scarce, and there is high risk associated with their supply. In a recent report, the Europea... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: CATL

China’s Electric Car Ambitions

Cobalt Shortages Ahead

Metal Markets In Flux