tag: CEA-Leti

More Lithography Options?
By Mark LaPedus - 03 Mar, 2015 - Comments: 1

Lithographers face some tough decisions at 10nm and beyond. At these nodes, IC makers are still weighing the various patterning options. And to make it even more difficult, lithographers could soon have some new, and potentially disruptive, options on the table. On one front, the traditional next-generation lithography (NGL) technologies are finally making some noticeable progress. For examp... » read more

Manufacturing Bits: March 3
By Mark LaPedus - 03 Mar, 2015 - Comments: 0

Nanoimprint consortium CEA-Leti has launched a nanoimprint lithography program in an effort to propel the technology in the marketplace. The imprint program, dubbed Inspire, will focus on various and emerging non-semiconductor applications, according to Laurent Pain, patterning program manager and business development manager within the Silicon Technologies division at the French R&D or... » read more

Manufacturing Bits: Feb. 24
By Mark LaPedus - 24 Feb, 2015 - Comments: 0

EUV progress report At the SPIE Advanced Lithography conference in San Jose, Calif., ASML Holding said that one customer, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), has exposed more than 1,000 wafers on an NXE:3300B EUV system in a single day. This is one step towards the insertion of EUV lithography in volume production. During a recent test run on the system, TSMC exposed 1,022 w... » read more

Unraveling The Mysteries At IEDM
By Mark LaPedus - 19 Dec, 2014 - Comments: 0

In some respects, the 2014 IEEE International Electron Devices Meeting (IEDM) was no different than past events. The event, held this week in San Francisco, included the usual and dizzying array of tutorials, sessions, papers and panels. On the leading-edge CMOS front, for example, the topics included [getkc id="82" kc_name="2.5D"]/[getkc id="42" kc_name="3D IC"] chips, III-V materials, [getkc ... » read more

Manufacturing Bits: Sept. 23
By Mark LaPedus - 23 Sep, 2014 - Comments: 0

The annual IEEE International Electron Devices Meeting (IEDM) will take place in San Francisco from Dec. 15-17. As usual, there will be presentations on the latest technologies in a number of fields, such as semiconductors, bio‐sensors, energy harvesting, power devices, sensors, magnetics, spintronics, two-dimensional electronics, among others. Here’s just some of the papers that will be pr... » read more

What Happened To Next-Gen Lithography?
By Mark LaPedus - 03 Sep, 2014 - Comments: 2

Chipmakers continue to march down the process technology curve. Using today’s optical lithography and multiple patterning, the semiconductor industry is scaling its leading-edge devices far beyond what was once considered possible. The question is how far can the industry extend 193nm immersion [getkc id="80" comment="lithography"] and multiple patterning before these technologies become t... » read more

Manufacturing Bits: Sept. 2
By Mark LaPedus - 02 Sep, 2014 - Comments: 0

Looking at space dust The first analysis of space dust, collected by a special collector onboard NASA's Stardust mission and sent back to Earth for study in 2006, is more complex in composition and structure than previously thought. Researchers examined the dust using synchrotron light sources from three groups--the U.S. Department of Energy's Argonne National Laboratory, Lawrence Berkeley... » read more

Manufacturing Bits: July 15
By Mark LaPedus - 15 Jul, 2014 - Comments: 0

Multi-beam hits milestone Mapper Lithography has reached a major milestone in its ongoing push to bring multi-beam, direct-write lithography into the mainstream. The Dutch-based company recently installed its initial pre-production tool at CEA-Leti, a French-based R&D organization. The tool, dubbed Matrix 1.1, is a multi-beam, e-beam system for direct-write applications. During the r... » read more

What Comes Next?
By SEMI - 27 Jun, 2014 - Comments: 0

The latest manufacturing, materials and production developments for emerging and adjacent markets will be featured at SEMICON West 2014 (www.semiconwest.org), to be held on July 8-10 at the Moscone Center in San Francisco, Calif. The co-location of emerging and adjacent market focused exhibitors and technical presentations within the framework of SEMICON West maximizes the synergies between sem... » read more

Manufacturing Bits: May 20
By Mark LaPedus - 20 May, 2014 - Comments: 0

Brain chips Pennsylvania State University has developed a technology that could enable futuristic biochips, namely those that mimic the human brain. In the lab, Penn State combined a thin film of vanadium dioxide (VO2) on a titanium dioxide substrate to create an oscillating switch. VO2 is an exotic material that exhibits semiconductor-to-metal transitions at 68 °C. In the R&D stage fo... » read more

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