Manufacturing Bits: Sept. 28

By Mark LaPedus - 28 Sep, 2021 - Comments: 0

Self-healing ceramics Texas A&M University has discovered a new self-healing mechanism for ceramics, a technology that could one day be used for jet engines, hypersonic aircraft and nuclear reactors. Ceramics involve various materials that are neither metallic nor organic, but rather they are crystalline and/or glassy, according to the University of Maryland. One common example is clay,... » read more

Manufacturing Bits: May 4

By Mark LaPedus - 04 May, 2021 - Comments: 0

Measuring Moon dust The National Institute of Standards and Technology (NIST) and others have developed a new way to study and measure moon dust. Using an X-ray nano computed tomography (XCT) technique, researchers measured the 3D shapes of lunar particles as small as 400nm in length. The goal is to find out how these shapes impact the optical scattering characteristics of lunar dust on the... » read more

Manufacturing Bits: June 2

By Mark LaPedus - 02 Jun, 2020 - Comments: 0

EUV lithography in outer space The U.S. space program made history on May 31, 2020, when NASA astronauts Robert Behnken and Douglas Hurley aboard SpaceX’s Crew Dragon spacecraft arrived at the International Space Station (ISS). This is the first time a commercial spacecraft has delivered astronauts to the ISS. The ISS serves as a research lab for companies, government agencies and universiti... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Center for the Advancement of Science in Space

Manufacturing Bits: Sept. 28

Manufacturing Bits: May 4

Manufacturing Bits: June 2

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Entities, people and technologies explored