Channel-Last GAA NS Oxide FET (Stanford, TSMC, ETH Zurich et al.)


A new technical paper titled "Channel-last gate-all-around nanosheet oxide semiconductor transistors" was published by researchers at Stanford University, TSMC, ETH Zurich, SLAC National Accelerator Laboratory, and Polish Academy of Sciences. Abstract "As we move beyond the era of transistor miniaturization, back-end-of-line-compatible transistors that can be stacked monolithically in the t... » read more

Manufacturing Of Next-Generation Channel Materials


One of the many challenges for the IC developers is to change the channel material to increase transistor mobility. But what about manufacturing? Can LED-style epitaxy be migrated to high-volume silicon manufacturing? “The use of Ge and InGaAs quantum wells is an extension of the current strained Si strategy," said Aaron Thean, vice president of process technologies and director of the log... » read more

Next Channel Materials?


Chipmakers are making a giant leap from planar transistors to [getkc id="185" kc_name="finFETs"]. Initially, [getentity id="22846" e_name="Intel"] moved into finFET production at 22nm and is now ramping up its second-generation finFETs at 14nm. And the other foundries will enter the finFET fray at 16nm/14nm. So what’s next? Chipmakers will likely extend the finFET architecture to both 10nm... » read more