Manufacturing Bits: April 4

By Mark LaPedus - 04 Apr, 2017 - Comments: 0

Open-source tomography software The University of Michigan, Cornell University and Kitware have developed an open-source software platform that enables three-dimensional imaging of nanomaterials. The open-source platform, dubbed Tomviz 1.0, enables researchers to image and process nanomaterials using electron tomography. Researchers can download the software. Using tomography, the software... » read more

Manufacturing Bits: Oct. 4

By Mark LaPedus - 04 Oct, 2016 - Comments: 0

China’s powerful laser The Shanghai Superintense-Ultrafast Lasers Facility (SULF) in China claims to have demonstrated the world’s most powerful laser. The ultra-intense, ultra-fast laser is said to have delivered a peak power of more than five petawatts. This is supposedly the largest peak-power laser pulse ever measured on record. A petawatt is equivalent to one quadrillion watts. ... » read more

Manufacturing Bits: July 5

By Mark LaPedus - 05 Jul, 2016 - Comments: 0

World’s largest telescope China stunned the industry last month, when the nation rolled out the world’s fastest supercomputer. The system, dubbed the Sunway TaihuLight, is based on processors made in China, not Intel or other U.S. chipmakers. Now, China has nearly finished the construction of the world’s largest radio telescope. The system, dubbed the Five-hundred-meter Aperture Sphe... » read more

System Bits: Dec. 1

By Ann Mutschler - 01 Dec, 2015 - Comments: 0

Extracting the right information in large data sets When solving complex scientific problems, researchers sometimes encounter what is called the curse of dimensionality, that is, they have so much data that they cannot efficiently analyze it. Large data sets can also be expensive and time consuming to acquire, so it is critical to gather only what is necessary. To this end, University of Il... » read more

Manufacturing Bits: Nov. 10

By Mark LaPedus - 10 Nov, 2015 - Comments: 1

Etching superconducting materials Superconductors are devices that have zero electrical resistance, making them attractive for a range of applications. But superconductors must be cooled down to temperatures at or near absolute zero on the Kelvin scale to work. This, in turn, limits their applications. Absolute zero equates to −273.15° on the Celsius scale and −459.67° on the Fahrenheit ... » read more

SITRI: Startup Funding And Support

By Ed Sperling - 08 Jun, 2015 - Comments: 0

Describing exactly what the Shanghai Industrial μTechnology Research Institute is like trying to read the fine print on a moving object. The organization is constantly in motion, shifting from one set of services to another, depending upon the recipient's needs, and redefining itself as it goes. The central theme is to promote and further the interest of startups working on "More Than Moore" a... » read more

Power/Performance Bits: Feb. 24

By Jesse Allen - 24 Feb, 2015 - Comments: 0

Simulating ultrafast phenomena Interesting phenomena can happen when electronic states in materials are excited during dynamic processes. As an example, electrical charge transfer can take place on quadrillionth-of-a-second, or femtosecond, timescales. Numerical simulations in real-time provide the best way to study these processes. Such simulations, however, can be extremely expensive. R... » read more

System Bits: August 5

By Ann Mutschler - 05 Aug, 2014 - Comments: 0

A better conductor There are now new clues about one of the baffling electronic properties of the iron-based high-temperature superconductor barium iron nickel arsenide, according to a Rice University-led team of U.S., German and Chinese physicists that has discovered, based on sophisticated neutron measurements, of a link between magnetic properties and the material’s tendency, at sufficien... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Chinese Academy of Sciences