A new technical paper titled "Cool-3D: An End-to-End Thermal-Aware Framework for Early-Phase Design Space Exploration of Microfluidic-Cooled 3DICs" was published by researchers at University of Michigan, Shanghai Jiao Tong University and University of Virginia.
Abstract
"The rapid advancement of three-dimensional integrated circuits (3DICs) has heightened the need for early-phase design spa...
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