Chiplets: Deep Dive Into Designing, Manufacturing, And Testing

By The SE Staff - 07 Aug, 2023 - Comments: 0

Chiplets are a disruptive technology. They change the way chips are designed, manufactured, tested, packaged, as well as the underlying business relationships and fundamentals. But they also open the door to vast new opportunities for existing chipmakers and startups to create highly customized components and systems for specific use cases and market segments. This LEGO-like approach sounds ... » read more

Week In Review: Design, Low Power

By Jesse Allen - 13 Jan, 2023 - Comments: 0

With funding from the Semiconductor Research Corporation, a group of 10 universities is banding together to create the Processing with Intelligent Storage and Memory center, or PRISM, led by University of California San Diego. The $50.5 million PRISM center will focus on four different themes: novel memory and storage devices and circuits; next generation architectures; systems and software; an... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 13 Jan, 2023 - Comments: 0

The head of the U.S. National Transportation Safety Board (NTSB), Jennifer Homendy, voiced concern about the impact of heavier electric vehicles (EVs) will have in crashes with smaller cars with internal combustion engines (ICEs). Homendy compared the weight of the GMC Hummer and the Ford F-150’s EV to ICE version and found the EVs are 2,000 to 6,000 pounds heavier. The extra weight in EVs is... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Chipletz

Chiplets: Deep Dive Into Designing, Manufacturing, And Testing

Week In Review: Design, Low Power

Week In Review: Auto, Security, Pervasive Computing