RISC-V Heralds New Era Of Cooperation

By Brian Bailey - 30 May, 2024 - Comments: 0

RISC-V is paving the way for open source to become accepted within the hardware community, creating a level of industry collaboration never seen in the past, while revitalizing the connection between academia and industry. The big question is whether this arrangement is just a placeholder while the industry re-learns how to develop processors, or whether this processor architecture is someth... » read more

Chiplets: Deep Dive Into Designing, Manufacturing, And Testing

By The SE Staff - 07 Aug, 2023 - Comments: 0

Chiplets are a disruptive technology. They change the way chips are designed, manufactured, tested, packaged, as well as the underlying business relationships and fundamentals. But they also open the door to vast new opportunities for existing chipmakers and startups to create highly customized components and systems for specific use cases and market segments. This LEGO-like approach sounds ... » read more

Week In Review: Design, Low Power

By Jesse Allen - 25 Feb, 2022 - Comments: 0

Tools & IP Codasip debuted two new customizable low power embedded RISC-V processor cores. To support embedded AI applications, the L31/L11 cores run Google’s TensorFlowLite for Microcontrollers. Codasip Studio tools can be used to customize for specific system, software, and application requirements. Licensing the CodAL description of a Codasip RISC-V core grants customers a full archit... » read more

Growth Spurred By Negatives

By Brian Bailey - 27 Jan, 2022 - Comments: 0

The success and health of the semiconductor industry is driven by the insatiable appetite for increasingly complex devices that impact every aspect of our lives. The number of design starts for the chips used in those devices drives the EDA industry. But at no point in history have there been as many market segments driving innovation as there are today. Moreover, there is no indication this... » read more

Week In Review: Design, Low Power

By Jesse Allen - 24 Sep, 2021 - Comments: 0

U.S. government officials met with semiconductor industry companies and automakers to request supply chain information it hopes could address the current semiconductor shortage, Reuters reports. Secretary of Commerce Gina Raimondo hopes the information will enable them and industry to "get more granular into the bottlenecks and then ultimately predict challenges before they happen," but also wa... » read more

Many Chiplet Challenges Ahead

By Brian Bailey - 12 Apr, 2021 - Comments: 0

Over the past couple of months, Semiconductor Engineering has looked into several aspects of 2.5D and 3D system design, the emerging standards and steps that the industry is taking to make this more broadly adopted. This final article focuses on the potential problems and what remains to be addressed before the technology becomes sustainable to the mass market. Advanced packaging is seen as ... » read more

Week In Review: Design, Low Power

By Jesse Allen - 26 Mar, 2021 - Comments: 0

Companies Pearl Semiconductor launched to provide low and ultra-low noise timing products. “Pearl is a timing company developing resonator-agnostic solutions. We work with quartz crystals, MEMS resonators or whatever achieves superior performance,” said Ayman Ahmed, CEO of Pearl Semiconductor. “Current and future automotive applications demand low noise and a wide operating temperatur... » read more

Waiting For Chiplet Standards

By Brian Bailey - 25 Mar, 2021 - Comments: 2

The need and desire for chiplets is increasing, but for most companies that shift will happen slowly until proven standards are in place. Interoperability and compatibility depend on many layers and segments of the supply chain coming to agreement. Unfortunately, fragmented industry requirements may lead to a plethora of solutions. Standards always have enabled increasing specialization. ... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 12 Mar, 2021 - Comments: 0

Automotive/Mobility General Motors is working on a next version of Ultium battery chemistry and announced a joint development agreement with Singapore-based SolidEnergy Systems, a lithium metal battery startup founded by a graduate of MIT. The companies plan to open a Woburn, Massachusetts prototype production line by 2023. GM’s is attempting to lower the cost of its proprietary battery tech... » read more

Chiplets For The Masses

By Brian Bailey - 03 Mar, 2021 - Comments: 2

Chiplets are a compelling technology, but so far they are available only to a select few players in the industry. That's changing, and the industry has taken little steps to get there, but timing for when you will be able to buy a chiplet to integrate into your system remains uncertain. While new fabrication nodes continue to be developed, scaling is coming to an end, be it for physical or e... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: CHIPS Alliance

RISC-V Heralds New Era Of Cooperation

Chiplets: Deep Dive Into Designing, Manufacturing, And Testing

Week In Review: Design, Low Power

Growth Spurred By Negatives

Week In Review: Design, Low Power

Many Chiplet Challenges Ahead

Week In Review: Design, Low Power

Waiting For Chiplet Standards

Week In Review: Auto, Security, Pervasive Computing

Chiplets For The Masses