By Mark LaPedus
The first wave of 2.5D chips using silicon interposers are trickling out in the marketplace.FPGA vendor Xilinx was the first chipmaker to ship a 2.5D device, and Altera, Cisco, Huawei and IBM recently have talked about their respective 2.5D chip developments.
Generally, Altera and Xilinx have taken a somewhat identical and straightforward approach. The two companies are sepa...
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