Foundry Landscape Changes In 3D

By Mark LaPedus - 13 Dec, 2012 - Comments: 0

By Mark LaPedus Over the last year, leading-edge silicon foundries announced their new and respective strategies in the emerging 2.5D/3D chip arena. The ink is barely dry and now the foundry landscape is changing. One new vendor, Tezzaron Semiconductor, is entering the market. The 3D DRAM supplier plans to provide select 2.5D/3D foundry services within its recently acquired fab in Austin, T... » read more

Straight Talk On 3D TSVs

By Ed Sperling - 13 Dec, 2012 - Comments: 0

By Mark LaPedus Semiconductor Manufacturing & Design sat down to discuss 3D device challenges and applications with John Lau, a fellow at the Industrial Technology Research Institute (ITRI), a research organization in Taiwan. SMD: What is ITRI doing in 3D TSVs? Lau: At ITRI we have developed the world’s first Applied Materials’ 300mm (3D TSV) integration line. The line was comple... » read more

End User Report: Reliability

By Ed Sperling - 15 Oct, 2009 - Comments: 0

John Kern, vice president of product operations inside Cisco Systems’ customer value chain management group, sat down with Low-Power Engineering to talk about the company’s internal focus on reliability and what factors are causing the most concern. What follows are excerpts of that conversation. By Ed Sperling LPE: How does Cisco gauge reliability? John Kern: The bulk of our re... » read more

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Foundry Landscape Changes In 3D

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End User Report: Reliability

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